{"id":2143085,"url":"https://alion.io/job/renesas-electronics-staff-package-design-engineer-2","title":"Staff Package Design Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":103,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":33,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bayan Lepas, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":20000,"max_usd":46000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1423},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false},{"name":"AutoCAD","optional":false},{"name":"HPC","optional":false}],"status":"live","first_seen_at":"2026-10-07T05:21:03Z","employer_posted_date":"2026-10-07","last_verified_at":"2026-10-12T14:46:50Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Summary\nWe are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies.\nThis role offers the opportunity to work on cutting edge technologies - such as power packages for AI/HPC, VPD, Server VR core/peripheral, and Accelerator/GPU markets - and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and next generation mobile computing.\nKey Responsibilities\nDesign and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging\nWork with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.\nWork with Product Groups and Reliability teams to qualify new packages and processes within required time frame.\nEnsure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.\nDevelop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.\nAddress internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.\n Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.\n5-15 years of relevant experience in package development emphasizing leadframe, laminate, power QFN/SiP/module, flip-chip packaging, and wafer Front-Side (FSM) / Back-Side (BM) Metallization processing.\nUnderstanding of semiconductor power device package assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wafer front-side / backside metallization, wire-bonding, flip chip, multi-chip module, SPC (Statistical Process Control) and statistical analysis.\nStrong interpersonal and communication skills.\nStrong analytical and presentation skills.\n Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. 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