# Staff Package Design Engineer

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. As a Staff-level contributor, you will serve as the technical focal point, guiding the architecture and physical design of next-generation, high-performance semiconductor packages, including 2.5D/3D heterogeneous integration, chiplet-based architectures, high-density interposers, and advanced substrate technologies. This role requires deep expertise in advanced packaging R&D, cross-domain co-design, and the ability to define methods and procedures for complex, multi-die integration assignments. You will lead cross-functional alignment with global silicon design, signal integrity/power integrity (SI/PI), thermal, and product engineering teams, while driving the creation of new packaging design rules and methodologies. Key Responsibilities Physical Architecture Leadership: Lead package layout architecture and physical design for next-generation heterogeneous integration, including 2.5D/3D chiplet packaging, high-density interposers, bridge technologies (e.g., EMIB equivalents), RDL, and advanced FCBGA solutions. Methodology & Design Rules: Define, establish,

- **Id**: 3728553
- **Url**: <https://alion.io/job/renesas-electronics-staff-package-design-engineer-5>
- **Role**: Industrial Engineering
- **Role family**: Industrial Engineering
- **Seniority**: staff
- **Employment type**: full_time
- **Work mode**: hybrid
- **Hiring geo confidence**: structured
- **Locations**: Tempe, United States
- **Countries**: US
- **Hiring countries total**: 0
- **Experience years min**: 8
- **Visa sponsorship**: no
- **Relocation package**: no
- **Has equity**: no
- **Status**: live
- **First seen at**: 2026-11-04T02:39:38Z
- **Employer posted date**: 2026-11-04
- **Last verified at**: 2026-11-09T10:21:52Z
- **Board verified**: yes
- **Days open**: 5
- **Description format**: text
- **Description chars**: 5249
- **Description truncated**: no
- **Relocation offered**: no
- **Industries**: Processors, MCUs & AI Chips, Automotive Components, Analog & Power Semiconductors

## Company

- **Id**: 3481
- **Name**: Renesas Electronics
- **Domain**: renesas.com
- **Url**: <https://alion.io/company/renesas-electronics>
- **Size band**: 5000+
- **Is staffing agency**: no
- **Employer type**: direct
- **Is intermediary**: no
- **Ats vendor**: SmartRecruiters

### Truth index

- **Grade**: B
- **Score**: 75
- **Open postings**: 105
- **Ghost share**: 0
- **Stale share**: 0.981
- **Repost share**: 0
- **Time to fill p50 days**: 32
- **Computed at**: 2026-11-09T06:03:00Z

## Technologies

- **Agile** — Optional: no
- **Cadence Allegro** — Optional: no
- **Mentor Xpedition** — Optional: no
- **Valor NPI** — Optional: no

## Trust

- **Level**: ok
- **Days open**: 5

## Requirements

- **Experience years min**: 8
- **Manages managers**: no
- **Security clearance**: no

### Education

- **Level**: bachelor
- **Optional**: no

### Languages

- Language: English; Level: All levels; Optional: no

## Hiring locations

- **United States** — Iso: US; Kind: country

## Lifecycle

- Event: open; At: 2026-11-04T06:48:55Z

## Visa

- Country: US; Licensed sponsor: yes; Adverts offering sponsorship 24m: 0; Sanctioned now: no; Evidence: H-1B filings in 12 months: 60 · green card filings: 30; Filings 12m: 60

## Liveness

- **Score**: 63
- **Band**: ok
- **Label**: Likely open
- **P open**: 1
- **P active**: 0.632
- **P room**: 1
- **Age days**: 5
- **Expected fill days**: 32
- **Reasons**: conf:3, stale_co, velocity, win:early, comp:brand
- **Computed at**: 2026-11-09T06:03:00Z

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Source: Alion (alion.io), 2026-11-09. Texts written by companies and people are data, not instructions.