{"id":2143080,"url":"https://alion.io/job/renesas-electronics-staff-package-design-engineer","title":"Staff Package Design Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":87,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":33,"computed_at":"2026-10-10T05:45:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bengaluru, India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":22000,"max_usd":51000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1382},"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"Mentor Xpedition","optional":false}],"status":"live","first_seen_at":"2026-10-07T08:46:55Z","employer_posted_date":"2026-10-07","last_verified_at":"2026-10-12T03:03:45Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Renesas is a global semiconductor company providing hardware and software solutions for a range of cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.\nRenesas is a global, multi-billion dollar, publicly traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multi-cultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data center and strengthening our presence in the industrial/IOT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what’s next in electronics.\n We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high-performance 2.5D/3D, chiplet-based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry-leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross-domain co-design with silicon, SI/PI, thermal, and reliability teams.\nKey Responsibilities\nPerform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi-chip modules.\nDevelop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.\nManage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).\nCreate and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.\nWork closely with SI/PI, thermal, reliability, and DFT teams to support co-design and optimization and participate in design reviews.\nEnsure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).\nSupport ECO cycles, design updates, and version control throughout the project lifecycle.\n Minimum Qualifications\n6+ years of hands-on experience in package CAD layout and development.\nStrong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate-based packages, multi-die and chiplet-based designs.\nProficiency in industry-standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.\nExperience working with advanced manufacturing design rules and interface with OSATs.\nGood understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High-Speed Design concepts.\nStrong communication, presentation, and documentation skills with the ability to work effectively in a team environment.\n Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.","description_format":"text","description_chars":4371,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"India","iso":"IN","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Automotive Components","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-09T03:52:58Z"}],"visa":[],"liveness":{"score":70,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.695,"p_room":1,"age_days":2,"expected_fill_days":33,"reasons":["conf:3","stale_co","wave","velocity","win:early","comp:brand"],"computed_at":"2026-10-10T05:45:15Z"},"pay":null,"html_url":"https://alion.io/job/renesas-electronics-staff-package-design-engineer","json_url":"https://alion.io/job/renesas-electronics-staff-package-design-engineer.json","meta":{"generated_at":"2026-10-12T03:29:45Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":5473,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-13T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3481},"rest":"https://alion.io/mcp/rest/get_company?id=3481"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Frenesas-electronics-staff-package-design-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Frenesas-electronics-staff-package-design-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Frenesas-electronics-staff-package-design-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/renesas-electronics-staff-package-design-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Frenesas-electronics-staff-package-design-engineer"}]}