{"id":3374279,"url":"https://alion.io/job/samsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm","title":"Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)","company":{"id":684996,"name":"Samsung Semiconductor","domain":"samsungsemiconductor.com","url":"https://alion.io/company/samsungsemiconductor","size_band":null,"is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Greenhouse","truth_index":{"grade":"B","score":84,"open_postings":8,"ghost_share":0,"stale_share":0.625,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Early Careers","role_family":"Early Careers","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":28,"max":68,"currency":"USD","period":"hour","gross":null,"usd_annual":136000},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":false},{"name":"HPC","optional":false},{"name":"MATLAB","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-10-28T00:27:28Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-10-29T13:35:37Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Please Note:\nTo provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. \nAdvancing the World’s Technology Together\nOur technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future. \nWe believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.\nWhat You’ll Learn\nProject Overview: Every new generation of AI accelerator pushes more power through stacked memory, and temperature is now one of the limits on how fast and how dense HBM can be. Our lab builds compact thermal models that turn workload-driven power maps of a 3D-stacked HBM into transient temperature maps in minutes rather than the hours a full CFD run takes, while staying close to CFD accuracy. As an intern you will own one piece of this platform end to end: from the physics and the CFD reference to a validated model that architecture, power, and package teams use to make design decisions.\nSkills You’ll Learn:Heat conduction in 3D-stacked die: TSV arrays, micro-bumps, underfill, and anisotropic effective properties\nCompact and reduced-order thermal modeling\nCFD modeling and validation with Simcenter Flotherm\nScientific computing at scale: sparse solvers, preconditioning, and fast Python/MATLAB code\nPower-thermal co-simulation and thermal-aware design of AI memory systems\n\nWhat You’ll Do\nSamsung’s Power & Thermal Lab is seeking a thermal engineering intern to help build and calibrate models of HBM stacks and package.\nWe are a small, fast-moving team where direct ownership and minimal busywork empower every member to tackle the same real-world problems. Working with authentic data, real partners, and production-grade results, our contributions flow straight into platforms used across the company.\nAs an intern, the models you build feed design discussions for future HBM products. You will work on real projects with tangible results, receive mentorship, and help shape the scope of work in a collaborative environment where hardware, software, and thermal experts work side-by-side on next-generation AI memory technologies.\nLocation: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy\nReports to: SVP, R&D (Power & Thermal Lab)\nBuild and calibrate CFD models (Simcenter Flotherm) of HBM stacks and packages under realistic cooling conditions, and use them as the reference for fast models.\nExtend our compact thermal model to new stack heights, die configurations, and base-die power, and quantify its accuracy against CFD in both steady state and transient.\nDevelop homogenization methods that replace fine features (TSV arrays, micro-bump layers, underfill) with effective properties, and establish where they hold and where they break.\nSpeed up thermal solvers by orders of magnitude through model-order reduction, sparse linear algebra and preconditioning, GPU acceleration, or machine-learning surrogates.\nRun transient simulations driven by real AI workload traces, locate spatiotemporal hotspots, and explore thermal-aware policies such as throttling, refresh control, and power-map scheduling.\nEvaluate advanced cooling and thermal-interface options (cold plates, two-phase cooling, TIMs, backside cooling) and translate them into boundary conditions and design guidance for HBM.\nCouple the thermal model with the lab's trace-driven power simulation engine so that power maps and temperature maps evolve together in time.\nDocument methods and results clearly and present them to engineers and lab leadership.\nComplete other responsibilities as assigned.\nWhat You Bring\nPursuing a PhD (preferred) or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field.\nMust have at least 1 academic quarter/semester remaining\nStrong foundation in heat transfer, especially transient conduction in multi-layer solids and thermal contact resistance.\nHands-on experience with numerical methods (finite-volume, finite-element, or finite-difference) and scientific programming in Python and/or MATLAB.\nAbility to judge simulation results critically (mesh convergence, boundary conditions, energy balance) and to explain discrepancies between models.\nExperience with Simcenter Flotherm, Ansys Icepak/Fluent, or COMSOL, preferred\nExperience with compact or reduced-order thermal models, model-order reduction, or ML surrogates for physical simulation, preferred\nBackground in electronics packaging, 3D-IC / chiplet thermal management, or advanced cooling, preferred\nFamiliarity with HPC, sparse linear solvers, or GPU programming, preferred\nYou’re inclusive, adapting your style to the situation and diverse global norms of our people.\nAn avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.\nYou’re collaborative, building relationships, humbly offering support and openly welcoming approaches.\nInnovative and creative, you proactively explore new ideas and adapt quickly to change.\nWhat We Offer\n The pay range below is for all roles at this level across all US locations and functions. Pay within this range varies by work location and may also depend on job-related knowledge, skills, and experience.\nThis is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones. In addition to the usual Medical/Dental/Vision, our inclusive rewards plan empowers our people to care for their whole selves. An investment in your future is an investment in ours.\nRelocation Support Live 50+ miles away from your new office? No worries! We'll provide a stipend to help support your move.\nHousing Stipend Signing a lease on a new place for your summer internship? We'll help you pay your way with a monthly stipend.\nGive Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.\nPrioritize Emotional Wellness With on-demand apps and paid therapy sessions, you’ll have support no matter where you are.\nStay Fit Eating well and being active are important parts of a healthy life. Our onsite Café and gym, plus virtual classes, make it easier.\nEmbrace Flexibility Benefits are best when you have the space to use them. That’s why we facilitate a flexible environment so you can find the right balance for you.\nHourly Base Pay Rate\n$28—$68 USD\nEqual Opportunity Employment Policy \nSamsung Semiconductor takes pride in being an equal opportunity workplace dedicated to fostering an environment where all individuals feel valued and empowered to excel, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status.\nWhen selecting team members, we prioritize talent and qualities such as humility, kindness, and dedication. We extend comprehensive accommodations throughout our recruiting processes for candidates with disabilities, long-term conditions, neurodivergent individuals, or those requiring pregnancy-related support. All candidates scheduled for an interview will receive guidance on requesting accommodations.\nOur Commitment to Innovation and Fairness\nAt Samsung Semiconductor, we use Artificial Intelligence (AI) tools in the recruitment process to enhance efficiency. However, AI is used as a support tool, not a final decision-maker. All hiring decisions are made by our human recruiting team and hiring managers to ensure every candidate is evaluated fairly and holistically.\nRecruiting Agency Policy\nWe do not accept unsolicited resumes. Only authorized recruitment agencies that have a current and valid agreement with Samsung Semiconductor, Inc. are permitted to submit resumes for any job openings.\nApplicant AI Use Policy \nAt Samsung Semiconductor, we support innovation and technology. However, to ensure a fair and authentic assessment, we ask that candidates rely on their own knowledge and skills throughout the process. AI tools may be used for basic preparation, grammar, and research, but should not be used to generate or assist with submitted content or live interview responses. If we determine that AI is being used outside these guidelines, we reserve the right to pause or end the interview, and your candidacy may be disqualified.\nTrade Secret Notice\nBy submitting an application, you agree not to disclose to Samsung-or encourage Samsung to use-any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.\nApplicant Privacy Policy\nhttps://semiconductor.samsung.com/about-us/careers/us/privacy/","description_format":"text","description_chars":9143,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["Flexible schedule"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":true,"industries":["Artificial Intelligence","Processors, MCUs & AI Chips","Memory & Storage Chips"],"lifecycle":[{"event":"open","at":"2026-10-28T02:14:14Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 147 · green card filings: 45","filings_12m":147,"filings_prev_12m":123,"green_card_filings_12m":45,"median_offered_wage_usd":168672,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":1,"expected_fill_days":54,"reasons":["conf:1","velocity","win:early","comp:junior"],"computed_at":"2026-10-29T05:49:05Z"},"pay":{"stated_usd_annual":136000,"is_top_pay":true},"html_url":"https://alion.io/job/samsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm","json_url":"https://alion.io/job/samsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm.json","meta":{"generated_at":"2026-10-29T16:36:04Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":24732,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-30T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":684996},"rest":"https://alion.io/mcp/rest/get_company?id=684996"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fsamsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fsamsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fsamsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/samsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fsamsung-semiconductor-intern-thermal-modeling-simulation-engineer-ai-memory-hbm"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3374279}},{"tool":"search_jobs","arguments":{"company":"samsungsemiconductor.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3374279},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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