{"id":2757446,"url":"https://alion.io/job/semidice-die-attach-operator-level-2","title":"Die Attach Operator Level 2","company":{"id":2318510,"name":"SemiDice -","domain":"semidice.com","url":"https://alion.io/company/semidice","size_band":null,"is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"ADP","truth_index":null},"role":"Field & Service","role_family":"Field & Service","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Milpitas, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":20,"max":24,"currency":"USD","period":"hour","gross":null,"usd_annual":48000},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-16T23:49:00Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-17T14:39:55Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"JOB DESCRIPTION\nJob Title: Die Attach Operator - All Levels FLSA Status: Non-Exempt\nJob Code: 25550, 25551, 25552, 25553Date Created: 8/15/2022\nReports To: Production Manager Date Revised: 8/15/2022\nDepartment Name: 170 - Mfg - Die Attach-Flip Chip Date Reviewed: 8/15/2022\nLocation: Silicon Valley\nPOSITION SUMMARY\nPerform automatic and manual die bonding with various equipment that bonds integrated circuit dies to substrates, lead frames and package cavity.\nKEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE\nLevel 1:\nOperate Stud Pull Test procedure and certified spec. \nOperate Die Shear Process Test Procedure and certified specifications.\nOperate and inspect X-ray.\nOperate XYZ Micro VU measurement tool.\nRecognize and select fixture and tooling.\nOperate UV cure.\nRecall and select profile for die attach reflow on RTC furnace silver glass.\nRecall and select profile for die attach reflow on WJ furnace hermetic and solder paste.\nRecall plasma machine program per traveler instruction.\nManual silver glass die attach operation.\nClean procedure (remove flux) bake.\nManual dam & fill can control fillet around the die given less space on cavity of the package.\nManual under fill and cure process.\nOperate Flip Chip Attach “SEC” machine.\nOperate Asymtek dispensing machine - old and new version. \nOperate MAT 6400 and Datacon.\nLevel 2:\nMix glass beads in to epoxy follow the mix ration.\nDie attach with customer consigned epoxy (high or low viscosity).\nManual attach DAP die without epoxy.\nManual stacks dies attach or components attach.\nTiny die (less than 0.015”) use wood stick pickup epoxy for DA. Thin die (less than 0.006”) use wood stick pickup epoxy for DA. \nManual or Auto dispense and attach stiffener to device.\nRecall Program Flip Chip Attach “SEC machine”.\nRecall program on Asymtek dispensing machine - old and new version. \nRecall program on MAT 6400.\nRecall program Datacon Operation.\nRecall profile for silver glass reflow on RTC Furnace and Glass Seal.\nRecall profile for die attach reflow on WJ Furnace Hermetic and Solder paste.\nLevel 3:\nSelect Eutectic Die Attach tooling, setup heat block temperature and operate machine.\nSetup Eutectic Die Attach machine included temperature.\nOperate Eutectic Die Attach manual.\nSetup new program Flip Chip Attach “SEC Machine”.\nSetup new program on Asymtek dispensing machine old and new version.\nSetup New Program on MAT 6400.\nSetup New Program on Datacon Operation.\nLevel 4\nProficient in all department skills.\nSet-up and operate automatic/manual Die Attach, Flip Chip and Dispenses equipment.\nOperate a variety of equipment, including high-powered microscopes, with speed and accuracy. \nFollow job traveler instructions accurately. \nIdentify and report process deviations to supervisor.\nMeet quality goals, safety requirements, and follow company policies.\nFlexibility to perform other duties as assigned. \nJOB REQUIREMENTS INCLUDE\nEducation: High School diploma or above required.\nExperience:\n6 months of semiconductor assembly in a Production environment preferred.\nExperience in second optical inspection may be applicable.\nKnowledge/Skills:\nExperience with: Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.).\nManual Dam & Fill operation and automatic equipment (Asymtek, etc.)\nAutomatic Die Attach bonders (Datacon, MAT6400, etc.) \nSemi-automatic Flip Chip bonders (SEC860, etc.)\n\nSUPERVISORY RESPONSIBILITIES\nTotal Number of Employees Directly Supervising: _0_\nNumber of Subordinate Supervisors Reporting to Position: _0_\nThis job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified. \nIn addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). \nI have read the job description, as well as the physical requirements below, and understand the expectations. By signing below, I acknowledge that I am able to perform the essential functions and meet the minimum requirements.\nEMPLOYEE___________________________________________ Date ____________\nPHYSICAL REQUIREMENTS INCLUDE\nIn an average workday, employee must (check one frequency for each task):\nTask\nNone\nOccasional\nFrequent\nConstant\nStand\nWalk\nSit\nBend/stoop\nClimb\nReach above shoulders\nSquat/crouch/kneel\nPush/pull\nLift\nUsual amount\n\n11-25 lbs\n26-50 lbs\n51+ lbs\nCarry\nUsual amount\n\n11-25 lbs\n26-50 lbs\n51+ lbs\n\nEmployee must use hands for repetitive action such as (please check all):\nTask\nRight\nHand\nLeft\nHand\nSimple grasping\nYes\nNo\nYes\nNo\nFirm grasping\nYes\nNo\nYes\nNo\nFine manipulation\nYes\nNo\nYes\nNo\n\nWORKING CONDITIONS INCLUDE\nIn an average workday, employee is exposed to (check one frequency for each task):\nTask\nNone\nOccasional\nFrequent\nConstant\nGeneral shop or store conditions\nGeneral office environment\nHumid, extreme hot/cold temps (non-weather)\nOutdoor weather conditions\nFumes or airborne particles\nFluorescent lights\nMoving, mechanical parts\nToxic chemicals\nLoud noise intensity levels\nRisk of electrical shock\nTravel for job","description_format":"text","description_chars":5252,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"high_school","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing","Semiconductor Equipment"],"lifecycle":[{"event":"open","at":"2026-10-17T02:02:28Z"}],"visa":[],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":0,"expected_fill_days":22,"reasons":["conf:3","win:early"],"computed_at":"2026-10-17T05:46:00Z"},"pay":{"stated_usd_annual":48000,"is_top_pay":false},"html_url":"https://alion.io/job/semidice-die-attach-operator-level-2","json_url":"https://alion.io/job/semidice-die-attach-operator-level-2.json","meta":{"generated_at":"2026-10-17T18:11:35Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":833,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-18T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":2318510},"rest":"https://alion.io/mcp/rest/get_company?id=2318510"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fsemidice-die-attach-operator-level-2"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fsemidice-die-attach-operator-level-2"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fsemidice-die-attach-operator-level-2"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/semidice-die-attach-operator-level-2\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fsemidice-die-attach-operator-level-2"}]}