Backend Process Engineer

Location: Alhambra, CA

Position Summary: The Backend Process Engineer -InPWafer Fab positionis responsible fordevelopment, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)-based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),andautomated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.

Responsibilities:

Backend Process Ownership and Optimization (35%):

• Own andoptimizebackend waferfabprocesses including lapping/thinning, n-side metallization, and RTA

• Establish robust process windows, recipes, and control limits for backend modules

• Maintain stable manufacturing performance through continuous monitoring and improvement

Yield Improvement, Defect Reduction, and AOI Control (25%):

• Own and maintain AOI processes for backend defect detection and yield monitoring

• Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations

• Analyze inline and post-process data toidentifytrends and systematic issues

• Implement corrective and preventive actions and verify effectiveness

Singulation,OpticalCoatings, and Packaging Interface Support (20%):

• Support cleaving, dicing, and singulation processes to ensure device integrity

• Provide process engineering support for AR/HR optical coatings and vendor qualifications

• Collaborate with packaging, device, and reliability teams to ensure packaging readiness

New Product Introduction and Technology Support (10%):

• Support new product introduction (NPI), process transfers, and technology changes

• Evaluate backend process risks associated withnew designs, materials, and device structures

Documentation, Process Control, and Manufacturing Support (10%)

• Author andmaintainSOPs, travelers, process specifications, and control plans

• Define SPC metrics and control strategies for backend processes

• Provide hands-on manufacturing and troubleshooting support as needed

Minimum Qualifications:

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field

• Minimum of 3+ years of experience inbackend semiconductor processing

• Hands-on experience with lapping/thinning, metallization, and thermal processes

• Understanding ofInP-based or III-V compound semiconductor wafer fabrication processes

• Experience with AOI systems, yield analysis, and data-driven process improvement

• Strong understanding of singulation, packaging interfaces, and reliability requirements

• Proficiencyin SPC, DOE, and statistical analysis

• Ability to work across cross-functional manufacturing and engineering teams

• Preferred experience withInPor III-V optoelectronic devices

• Familiarity with AR/HR optical coating processes

• Experience supporting high-mix, low-volume manufacturing environments preferred

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essentialjobfunctions and requirements and are subject topossible modificationtoreasonably accommodateindividuals with disabilities.

A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration indeterminingbase salary, including but not limited to: job-related qualifications, skills,educationand experience, as well as job location and the value of other elements of an employee’s total compensation package.