{"id":3239892,"url":"https://alion.io/job/semtech-wafer-fab-supervisor","title":"Wafer Fab Supervisor","company":{"id":58922,"name":"Semtech","domain":"semtech.com","url":"https://alion.io/company/semtech","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":19,"ghost_share":0,"stale_share":0.632,"repost_share":0,"time_to_fill_p50_days":47,"computed_at":"2026-10-28T05:59:10Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["City of Industry, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":82000,"max":117000,"currency":"USD","period":"year","gross":null,"usd_annual":117000},"salary_estimate":null,"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"CVD","optional":false},{"name":"Photolithography","optional":false},{"name":"Plasma Etch","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-23T00:00:00Z","employer_posted_date":"2026-10-23","last_verified_at":"2026-10-28T21:28:40Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Location: Rowland, CA (Onsite)\nPosition Summary: The Wafer Fab Supervisor leads a team of process technicians and operators responsible for daily wafer fabrication operations across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC). This role is accountable for safe, on-schedule, high-yield production across the fab process modules - photolithography, PECVD, dry etch, wet etch, and metallization - including the Mesa etch and MOCVD epitaxial regrowth support steps used to form the buried heterostructure. The Supervisor sets daily priorities, balances staffing and tool capacity, and ensures strict Process-of-Record (POR) discipline in a III-V cleanroom environment.\nWorking closely with Process Engineering, Equipment Engineering, Quality, and Production Planning, the Supervisor drives throughput, cycle-time, and yield performance, directs escalation and root-cause response for process excursions, and develops technicians and operators through coaching, training, and clear performance expectations to sustain reliable, high-volume manufacturing.\nResponsibilities:\nProduction Operations Management:\nPlan and direct daily wafer fab production across photolithography, PECVD, dry etch, wet etch, and metallization to meet weekly and monthly wafer-out, throughput, and cycle-time targets for InP BH DFB laser and BH GC products\nSet lot priorities and sequence hot lots, engineering wafers, and standard production lots in coordination with Production Planning to sustain high tool utilization\nConduct shift handoffs and daily production meetings, and track work-in-process, tool status, and line constraints to proactively resolve bottlenecks\nCoordinate tool downtime, preventive maintenance, and repair priorities with Equipment Engineering to protect production schedule adherence\nOversee supplies, consumables, and chemical and gas inventory for the fab areas, and escalate shortages that threaten the production schedule\nReview lot travelers, process records, and hold/release dispositions to ensure complete and accurate lot documentation\nTeam Leadership & Development:\nLead, schedule, and assign work to technicians and operators to maintain proper coverage across fab process areas and shifts\nSet clear performance expectations, provide regular coaching and feedback, and complete performance reviews; address performance and attendance issues in partnership with Human Resources\nDevelop and maintain a training and certification program, including cross-training to build flexible coverage across litho, thin film, etch, and metallization modules\nParticipate in hiring, onboarding, and retention of fab technicians and operators\nPromote a culture of ownership, accountability, and open communication across the team\nProcess Control, Yield & Troubleshooting Oversight:\nEnsure adherence to POR, recipes, and work instructions, and review SPC charts and out-of-control events with process owners to confirm timely corrective action\nDirect escalation and response for process excursions and drift, and partner with Process Engineering to drive root-cause investigation and verified corrective actions\nMonitor yield, defect, and rework trends and work with Process Engineering and Quality to prioritize improvement actions\nSupport DOEs, process qualifications, and NPI process runs by scheduling resources and coordinating tool and lot availability\nSafety, Compliance & Continuous Improvement:\nEnforce EHS requirements for chemical, process gas, and precious metal handling, cleanroom protocols, and equipment lockout/tagout; lead safety briefings and incident reporting and follow-up\nEnsure compliance with quality system, document control, and training record requirements\nLead continuous improvement projects to improve throughput, cycle time, yield, cost, and cleanroom efficiency\nMaintain accurate production metrics and communicate performance, risks, and resource needs to fab management\nEducation and Experience:\nBachelor's degree in engineering, materials science, chemistry, physics, or related technical field preferred; associate degree with equivalent experience considered\n8 - 12 years of experience in semiconductor/photonics wafer processing, with direct III-V/InP process experience\n2 - 3 years of experience in a lead, supervisory, or team leadership role in a wafer fab or similar high-volume manufacturing environment\nHands-on production experience across all wafer fab process areas (photolithography, PECVD, dry etch, wet etch, and metallization) required, with direct III-V/InP experience in each\nQualifications\nStrong working knowledge of the complete wafer fab process flow for III-V devices, with the technical depth to supervise, troubleshoot, and cover all process areas: photolithography, PECVD, dry etch, wet etch, metallization, and in-line metrology\nDemonstrated ability to step in and support any fab process area, and to cross-train and qualify technicians across modules to build flexible shift coverage\nDemonstrated ability to lead and develop a technician and operator team in a high-volume production environment\nProven ability to manage throughput, cycle-time, and WIP targets and to prioritize competing demands\nWorking knowledge of SPC, root-cause analysis, and structured problem-solving methods\nStrong understanding of cleanroom, chemical, and process gas safety requirements\nEffective communication and collaboration with technicians, operators, engineers, planning, and management\nProficiency with MES or lot tracking systems and standard office software\nAbility to work in a cleanroom environment for extended periods across multiple process bays\nAbility to work around chemicals (acids, solvents), process gases, and precious metals with proper safety procedures\nMay require flexibility to support engineering runs, excursions, or production needs outside standard shift hours\nThe intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.\nAll duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.\nA reasonable estimate of the pay range for this position is $82,000 - $117,000. 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