{"id":3481366,"url":"https://alion.io/job/sitime-package-development-engineer","title":"Package Development Engineer","company":{"id":58930,"name":"SiTime","domain":"sitime.com","url":"https://alion.io/company/sitime","size_band":"1-10","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Greenhouse","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taipei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":18500,"max_usd":41000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":8444},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"CAPA","optional":false},{"name":"JMP","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-16T01:59:52Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-31T17:17:16Z","board_verified":true,"closed_at":null,"days_open":15,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":15},"description":"About SiTime\nSiTime is the Precision Timing company.\nTiming is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.\nOur semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.\nJob Summary\nWe are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Thailand, focusing on QFN/LGA assembly technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands-on engineer to make a significant impact on cutting-edge semiconductor packaging technologies within a dynamic and innovative environment.\nResponsibilities:\nDevelop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing and flip-chip bonding processes…\nConduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.\nPerform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues and defects.\nCollaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.\nDefine and maintain process specifications, control plans, and standard operating procedures (SOPs).\nEvaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.\nLead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.\nProvide technical support and training for manufacturing operators and technicians.\nStay updated with the latest industry trends and advancements in packaging technologies.\n60% OSATs onsite (in Bangkok/Ayutthaya), 10% travel (Asia/US). \nQualifications & Requirements: \nBachelor, Master to PhD's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.\nMinimum of 5 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of QFN/LGA and Flip-chip bonding technologies.\nIn-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).\nProficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.\nExperience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).\nStrong problem-solving skills and a data-driven approach to decision-making.\nExcellent communication, interpersonal, and teamwork skills.\nAbility to work independently and manage multiple projects simultaneously in a fast-paced environment.\nFluency in English is required.\nCompensation Range: \nAt SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.\nIn addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals-reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.\nSiTime is committed to providing equal employment opportunities to all employees and applicants. Employment decisions are based on qualifications, merit, and business needs. We do not discriminate on the basis of any characteristic protected by applicable law.\nLearn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique. \nInnovation on Top - Philosophies of Innovation with Rajesh Vashist\nFabrication Knowledge - An Interview with Rajesh Vashist\n SiTime Corporation - YouTube","description_format":"text","description_chars":4530,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":["Equity"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Passive Components & Connectors","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-29T20:14:17Z"}],"visa":[],"liveness":{"score":77,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":0.9,"age_days":15,"expected_fill_days":28,"reasons":["conf:3","velocity","win:mid","comp:brand"],"computed_at":"2026-10-31T05:58:55Z"},"pay":null,"html_url":"https://alion.io/job/sitime-package-development-engineer","json_url":"https://alion.io/job/sitime-package-development-engineer.json","meta":{"generated_at":"2026-10-31T19:45:20Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":31109,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-01T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58930},"rest":"https://alion.io/mcp/rest/get_company?id=58930"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fsitime-package-development-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fsitime-package-development-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fsitime-package-development-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/sitime-package-development-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fsitime-package-development-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3481366}},{"tool":"search_jobs","arguments":{"company":"sitime.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3481366},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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