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Salary
≈ $93k – $175k per year (Estimated)
Location
In office (Temecula)
Seniority
Staff · 8+ years exp

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Sep 23, 2026.

Overview
Company
Impact
Profile match
Play Video Wafer Scale Manufacturing The Tru-SiPh™ platform was built from the ground up to disrupt the traditional photonics markets in multiple applications. Tru-SiPh™ is being designed into ethernet pluggable modules, into copackaged optics, into Lidar, and into biosensor applications.

Description

Position Overview

The Manager of Process Integration Engineering leads the Integration engineering team and the department efforts to achieve or exceed revenue targets. Leads complex R&D projects related to incoming technology transfer, productization, new product introductions, yield improvement, cycle time reductions and other improvements. Engages directly with customers to guide Skorpios efforts specific to the project.

Position Overview

The Director of Process Integration Engineering leads the Integration and Technology Transfer team in executing fab solutions across two core business pillars: specialty test wafer manufacturing and comprehensive foundry services for external fabless partners. This role directs customer technology execution, incoming process transfers, yield ramps, and cycle time reductions, serving as the lead technical authority and primary interface for commercial clients. The Director directly impacts top-line revenue by establishing robust, repeatable manufacturing solutions that take customer designs from early prototyping to high-volume manufacturing (HVM).

Key Responsibilities

Reasonable accommodations may be made to enable individuals with disabilities to perform these essential responsibilities.

  • Customer Co-Development & Technical Governance: Act as the primary technical interface for external fabless customers, translating device architectures and milestone requirements into actionable process flows and objective engineering specifications.
  • Technology Execution & Transfer: Oversee incoming technology transfer, prototyping, productization, and yield ramps for multi-client foundry programs and specialized test wafer offerings.
  • Revenue & Operational Delivery: Direct departmental engineering initiatives to meet or exceed company revenue goals by hitting customer milestones, accelerating fab cycle times, and maximizing wafer output yields.
  • Process Module Integration: Define Objective Specification documents, formulate complex Design of Experiments (DOE), and implement Statistical Process Control (SPC) methods to develop and qualify macro modules across CVD, PVD, Etch, Wet Cleans, Photolithography, and CMP.
  • Inline Metrology & Parametric Correlation: Correlate final device parameters with inline fab metrology, defect inspections, and process metrics to accelerate root-cause failure analysis (FA) and continuous yield improvements.
  • Cleanroom Problem Solving: Participate in and direct hands-on cleanroom inspections for critical excursions, complex tool/process interactions, and cross-contamination prevention in a multi-tenant environment.
  • Cross-Functional Orchestration: Lead and influence cross-functional operations, process engineering, and equipment teams without direct authority to align priorities, resolve operational bottlenecks, and safeguard project delivery schedules.

Supervisory & People Responsibilities

  • Directly lead, mentor, and evaluate the Process Integration and Technology Transfer team.
  • Oversee talent acquisition, onboarding, technical skill advancement, resource allocation, and individual performance management.
  • Establish clear accountability and project milestones across multiple concurrent external accounts.

Requirements

Education: Master’s or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or related discipline.

  • Experience: 8+ years of industrial semiconductor or MEMS-based fab integration experience spanning a broad range of applications and front-end processes (Lithography, Dry/Wet Etch, CMP, Thin Films/PVD/CVD).
  • Leadership: Proven project management expertise and engineering team leadership, with a track record of driving complex customer-facing R&D initiatives to completion.
  • Technical Depth: In-depth knowledge of process mixing, cross-contamination control, Failure Mode and Effects Analysis (FMEA), defect analysis, and statistical methodology (DOE, SPC).
  • Customer Interfacing: Demonstrated success engaging directly with commercial customers, managing project reviews, and delivering on technical and tactical commitments.

Salary Description

190,000 to 225,000

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