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Salary
≈ $15k – $35k per year (Estimated)
Location
Hybrid (Taipei, Hsinchu, Taiwan)

Confirmed on the employer's own hiring board on Oct 16, 2026. First seen by Alion on May 26, 2026. STMicroelectronics scores B on the Alion truth index.

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STMicroelectronics is a European semiconductor company headquartered in Geneva that designs and manufactures microcontrollers, sensors, power and analog chips, and imaging devices for automotive, industrial, personal electronics and communications markets. Formed in 1987 from the merger of SGS Microelettronica and Thomson Semiconducteurs and listed in Paris, Milan and New York, it employs people of more than 115 nationalities in 40 countries, with fabs and sites in Crolles, Grenoble, Agrate Brianza, Catania, Singapore, Muar and Calamba. It hires process and validation engineers, facilities and NPI engineers, test operators, HR partners and engineering interns.
Backed by Omnes Capital

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

As a Applications Engineer with a focus on Design Enablement, you will be a key enabler of the next generation of AI infrastructure. You will support customers designing high-speed optical interconnects that power massive GPU clusters and hyperscale data centers. This role is critical for the industry's expanded focus on Pluggable Optics as well as transition to advanced Co-Packaged Optics (CPO), which are essential for connectivity in AI Data Centers.

In this role, you will act as the main technical bridge between ST’s foundry customers designing EIC and PIC components for 1.6T, 3.2T and higher data rate optical engines using ST’s Silicon Photonics, SiGe BiCMOS , Advanced Packaging and other related process technologies.

The candidate will collaborate with customers’ design and operations teams along with ST’s internal marketing, sales, business unit, foundry and central R&D teams.

Job Responsibilities

Provide training and on-boarding to ramp-up up foundry customers’ design teams on ST process platforms

  • Provide timely and effective support to technical issues or customer questions regarding ST PDK and IP/library deliveries for simulation, layout, extraction, reliability.
  • Enhance PDK documentation, develop application notes and best practices to be shared with customer(s) and internal teams.
  • Lead regular (Weekly, bi-weekly, quarterly) technical calls with customer and internal teams to ensure smooth execution of assigned design programs from inception to product tape-out, delivery of engineering samples and production ramp-up.
  • Participate in definition of photonic/electronic reference designs, proof-of-concept board/system builds.
  • Stay updated with industry trends and advancements in semiconductor/photonics technology to incorporate best practices into PDK/IP/libraries development.

Required Qualifications:

We are looking for candidates who understand the intersection of light and silicon with product development or applications expertise in at least one of the following:

  • Silicon Photonics (SiPh): Direct experience with PIC (Photonic Integrated Circuit) design, waveguide theory, and integrated lasers/modulators.
  • High-Speed RF / SiGe BiCMOS: Expertise in 100G/200G+ per-lane electrical interfaces, TIAs, and drivers. Understanding of SiGe HBT physics for ultra-high-speed signaling.
  • CMOS Image Sensor (CIS) R&D: We strongly value candidates from a CIS background. Your experience with pixel-level nanophotonics, complex optical stacks, and non-Manhattan layouts translates effectively to the challenges of managing light in silicon waveguides.

Additional Qualifications:

  • BSEE and 8+ years and/or MSEE +6yrs
  • Working knowledge of data center architectures, interconnect technologies, optical transceivers.
  • Engineer designation depending on level of experience.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.

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