{"id":2287217,"url":"https://alion.io/job/stmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh","title":"CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H","company":{"id":41463,"name":"STMicroelectronics","domain":"st.com","url":"https://alion.io/company/st","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":75,"open_postings":10,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Hardware","role_family":"Hardware","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Grenoble, France"],"countries":["FR"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":42000,"max_usd":77000,"period":"year","method":"role_country_seniority_unknown","sample_n":57},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-08-13T07:18:45Z","employer_posted_date":"2026-10-02","last_verified_at":"2026-10-13T03:18:26Z","board_verified":true,"closed_at":null,"days_open":60,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":60},"description":"At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.\nWhen you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.\nDeveloping technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo,drive innovation, and unlock their own potential.\nEmbark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.\n\nVersion Française (English version below)\nÀ propos du poste\nAu sein de l’équipe R&D dédiée à l’Advanced Packaging pour la microélectronique, vous contribuerez au développement, à la qualification et à l’industrialisation des procédés de Flip-Chip destinés aux produits Photonics de STMicroelectronics.\nÀ ce titre, vous jouerez un rôle clé dans la qualité, la performance et la compétitivité des futures générations de produits, en intervenant sur l’ensemble du cycle de développement, de la conception des procédés jusqu’à leur transfert en production.\nDéveloppement des procédés\nVous aurez pour missions de :\nDévelopper et optimiser les procédés de Flip-Chip pour les produits Advanced Packaging - Photonics de STMicroelectronics.\nIdentifier les fenêtres de fonctionnement et les paramètres critiques des équipements installés en environnement salle blanche, en collaboration étroite avec un technicien Flip-Chip.\nDéfinir, réaliser et analyser des plans d’expériences (DOE).\nÉvaluer de nouveaux équipements et matériaux sur les plateformes de Grenoble ou directement chez les fournisseurs.\nContribuer au développement de technologies avancées telles que le fine pitch, la thermocompression et l’hybrid bonding, en lien avec les équipes Advanced Packaging de Crolles.\nAccompagner la ligne pilote de Grenoble dans la fabrication de prototypes.\nCollaborer étroitement avec les différentes équipes ST : R&D Grenoble, Agrate et Singapour, équipes Advanced Packaging de Crolles, Design, Qualité ainsi que les sites industriels Back-End de Malte, des Philippines et de Chine.\nQualification et fiabilité\nVous serez amené(e) à :\nPiloter la qualification et la validation des procédés conformément aux standards de fiabilité applicables.\nRéaliser des analyses de risques.\nContribuer aux analyses de défaillance et définir les actions correctives nécessaires tout au long des phases de développement.\nIndustrialisation\nDans le cadre de l’industrialisation des procédés, vous serez chargé(e) de :\nAccompagner les transferts technologiques et les montées en cadence sur les sites de production Back-End de STMicroelectronics, dans le cadre de déplacements ponctuels sur site.\nAssurer la formalisation des activités selon les standards ST : reporting, documentation In Process Control, suivi des paramètres clés, plans de contrôle et méthodologie 8D.\nInnovation\nVous participerez activement à :\nLa construction et l’évolution de la feuille de route technologique Advanced Packaging.\nLa rédaction de brevets, de publications techniques et la participation à des conférences spécialisées.\nÀ propos de vous\nVous êtes titulaire d’un diplôme de niveau Master, Doctorat ou d’une formation équivalente en science des matériaux, métallurgie ou dans un domaine connexe.\nVous vous distinguez par :\nUn fort intérêt pour le développement de procédés et les technologies avancées du semi-conducteur.\nUne expérience en développement de procédés et/ou en industrialisation, qui constitue un véritable atout.\nDes connaissances en Flip-Chip Packaging, Photonique et/ou Advanced Packaging.\nUne maîtrise des plans d’expériences (DOE) et de l’analyse statistique.\nUne bonne connaissance des approches d’analyse de risques (FMEA).\nUne expérience ou une familiarité avec les méthodologies d’analyse de défaillance.\nDe solides capacités d’analyse, de résolution de problèmes et d’autonomie technique.\nUne aptitude à travailler efficacement dans un environnement international et en collaboration avec des équipes pluridisciplinaires.\nUn bon niveau d’anglais professionnel.\nOutils et méthodologies\nJMP (analyse statistique)\nMéthodologie de résolution de problèmes 8D\nPourquoi ce poste est attractif ?\nVous contribuerez au développement de technologies de nouvelle génération dans les domaines de la photonique et de l’Advanced Packaging, au cœur des innovations qui façonneront les futurs produits semi-conducteurs de STMicroelectronics. Ce poste offre une forte exposition internationale, une proximité avec les équipes R&D et industrielles, ainsi qu’une implication directe dans des projets à fort contenu technologique et innovant.\nEnglish version\nYOUR ROLE\nInside an R&D team dedicated to microelectronic Advanced Packaging, the missions will consist in developing, qualifying, and industrializing Flip-Chip processes for STMicroelectronics’ Advanced Packaging - Photonics products, in order to ensure the quality, performance, and competitiveness of future product/package generations.\nProcess Development:\nResponsible for the development and optimization of Flip-Chip processes for ST Advanced Packaging - Photonics products\nIdentify process windows and critical parameters on equipments installed in cleanroom environment and in collaboration with a Flip-Chip technician \nDefine, execute, and analyze design of experiments (DOE)\nEvaluate new equipments and materials on Grenoble equipments or at suppliers plant\nContribute to the development of advanced technologies such as fine pitch, thermocompression, and hybrid bonding with the Advance Packaging team in Crolles\nSupport the Grenoble Pilot Line in prototype manufacturing\nCollaborate with internal ST teams: R&D Grenoble (Agrate, Singapore), Crolles Advanced Packaging, Design, Quality, Back-End plants (Malta, Philippines, China)\nQualification and Reliability:\nDrive process validation through reliability standards\nPerform risk analyses\nSupport failure analyses and define corrective actions during the development phases\nIndustrialization:\nEnsure transfer and production ramp-up support at ST Back-End sites (on-site missions)\nFormalization according to ST standards: reporting, In Process Control documentation, key parameters monitoring, control plans, 8D\nInnovation:\nContribute to the Advanced Packaging technology roadmap\nParticipate in patent filings, publications, and conferences\nYOUR SKILLS & EXPERIENCES\nMaster or PhD degree in Materials science and metallurgy, or a related field. \nExperience in process development or industrialization is highly valued.\nFlip-Chip Packaging, Photonics, advanced packaging\nDOE and statistical analysis\nFMEA / risk management\nFailure analysis\nTechnical leadership, autonomy, analytical mindset, cross-functional collaboration, communication in an international environment\nProfessional English required\nTools and Methods:\nJMP software (Statistical analysis)\n8D\nST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.\nAt ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.\nTo discover more, visit st.com/careers.","description_format":"text","description_chars":8159,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"French","level":"Advanced (C1)","optional":false},{"language":"English","level":"All levels","optional":false}]},"benefits":["Equity"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Optical Communications","Sensors & Transducers","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-11T14:27:43Z"}],"visa":[],"liveness":{"score":8,"band":"cold","label":"Long shot","p_open":1,"p_active":0.243,"p_room":0.35,"age_days":59,"expected_fill_days":20,"reasons":["conf:3","stale_co","win:tail","comp:brand"],"computed_at":"2026-10-12T06:55:09Z"},"pay":null,"html_url":"https://alion.io/job/stmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh","json_url":"https://alion.io/job/stmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh.json","meta":{"generated_at":"2026-10-13T04:39:52Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":7262,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-14T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":41463},"rest":"https://alion.io/mcp/rest/get_company?id=41463"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fstmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fstmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fstmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/stmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fstmicroelectronics-cdi-flip-chip-process-development-engineer-advanced-packaging-photonics-fh"}]}