17450 - R&D Engineering, Executive Director 3DIC-Advanced Packaging

Job Description and Requirements

We Are Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You have spent the better part of two decades building semiconductor solutions that actually ship, not just pass design reviews, and you know that the hardest problems in 3DIC are never just technical. They live at the intersection of physics, economics, and customer reality. You understand that a chiplet architecture is only as good as the yield curve it produces and the system performance it enables, and you have made the tradeoffs enough times to know which ones matter.

You lead organizations that span continents and disciplines, and you have learned that the difference between a team that delivers and one that stalls is usually clarity. Clarity of purpose, clarity of decision rights, clarity of what good looks like. You do not manage by deck, you manage by walking into a room, understanding the blocker, and removing it.

You have credibility with customers because you have been in the room when a design did not work and you helped fix it. You have credibility with engineers because you still understand the signoff flow. You think in roadmaps, not features, and you know how to translate a market shift into a three-year technical plan that your team can actually execute. At Synopsys, you will shape the future of heterogeneous integration for AI and high-performance computing, and the team you build will define what is possible.

What You'll Be Doing

• Lead the global engineering organization responsible for 3DIC silicon IP and advanced packaging design, covering layout, physical design, signal integrity, power integrity, thermal modeling, and mechanical stress analysis for AI infrastructure and HPC products
• Own the technical roadmap and execution strategy for chiplet architectures, heterogeneous integration, and die-to-die interconnect solutions that align with Synopsys business objectives and customer requirements
• Drive cross-functional collaboration with EDA tool development teams, product management, go-to-market, and customer success to ensure Synopsys 3DIC solutions are differentiated, adoptable, and production ready
• Engage directly with leading semiconductor customers and ecosystem partners to shape technical requirements, validate architectures, and accelerate adoption of Synopsys 3DIC and advanced packaging IP
• Build, scale, and mentor a high-performing, multi-site engineering team, establishing a culture of accountability, technical excellence, and continuous improvement
• Track and synthesize industry trends in 3DIC, chiplets, and advanced packaging, translating emerging technologies and competitive dynamics into actionable product and technology decisions
• Make sound engineering tradeoffs across performance, power, area, cost, yield, and manufacturability, ensuring solutions meet both technical and business success criteria

The Impact You Will Have

• Define and deliver the silicon IP portfolio that enables Synopsys customers to build next-generation AI accelerators, data center processors, and high-performance compute systems using 3DIC and advanced packaging
• Shape the long-term technology roadmap for Synopsys in heterogeneous integration, influencing how the semiconductor industry approaches chiplet design, integration, and signoff
• Drive measurable improvements in customer time-to-market and design success rates by delivering production-proven 3DIC IP and advanced packaging solutions that solve real signoff and yield challenges
• Strengthen Synopsys competitive position in the 3DIC and advanced packaging market by building deep technical partnerships with foundries, OSAT providers, and leading chip companies
• Accelerate adoption of Synopsys EDA tools and IP by ensuring 3DIC solutions are tightly integrated, validated, and supported across the full design and verification flow
• Develop the next generation of technical leaders within Synopsys by building a team culture that values mentorship, cross-functional collaboration, and engineering rigor
• Contribute to Synopsys revenue growth and strategic differentiation by delivering high-impact IP solutions that directly enable customer success in the most demanding semiconductor applications

What You'll Need

• Bachelor's or Master's degree in Electrical Engineering or a related technical discipline, or equivalent professional experience with demonstrated technical leadership in semiconductor design
• 15+ years of hands-on experience in the semiconductor industry with deep expertise in advanced packaging, 3DIC technologies, chiplet architectures, and heterogeneous integration
• Proven track record building and leading large, geographically distributed engineering organizations that have delivered complex 3DIC or advanced packaging solutions from architecture through production
• Deep technical command of 3DIC-specific design and signoff challenges including signal integrity, power integrity, thermal management, mechanical stress, reliability physics, and yield optimization
• Demonstrated ability to define and execute multi-year technology roadmaps for silicon IP or advanced packaging, balancing technical vision with business strategy and market requirements
• Strong customer-facing leadership experience, including direct engagement with semiconductor customers, foundries, and ecosystem partners to define requirements, validate solutions, and drive adoption
• Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority

Who You Are

• You can walk into a technical review with your team, identify the core issue in a complex 3DIC signoff problem, and outline a path forward that balances technical correctness with schedule reality
• You build teams that want to work for you again, not because you are easy to work for, but because you are clear, you remove obstacles, and you give people hard problems they can actually solve
• You can sit across the table from a VP of Engineering at a top five semiconductor company, understand their chiplet integration challenges, and translate that into a technical requirement your team can execute against
• You make tradeoff decisions with incomplete information, and you are comfortable explaining the reasoning behind those decisions to both your team and executive leadership
• You recognize when a technical plan is drifting from a business objective and you course-correct before it becomes a crisis, not after
• You invest in the growth of your engineers, you know who is ready for the next level, and you create opportunities for them to get there

The Team You'll Be Part Of

Your recruiter will share more about the team structure and mission during the interview process.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.