{"id":1311251,"url":"https://alion.io/job/synopsys-rd-senior-solutions-architect-package-substrate-eda-18086","title":"R&D Senior Solutions Architect, Package Substrate EDA 18086","company":{"id":39954,"name":"Synopsys","domain":"synopsys.com","url":"https://alion.io/company/synopsys-inc","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Avature","truth_index":{"grade":"A","score":100,"open_postings":75,"ghost_share":0.04,"stale_share":0,"repost_share":0.173,"time_to_fill_p50_days":15,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Solutions","role_family":"Solutions","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Sunnyvale, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":130000,"max_usd":253000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":766},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"C++","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-09-26T16:23:53Z","employer_posted_date":"2026-09-26","last_verified_at":"2026-10-21T12:48:51Z","board_verified":true,"closed_at":null,"days_open":24,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":24},"description":"Job Description and Requirements\nSenior Solutions Architect, Package Substrate EDA\nWe Are\nSynopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.\nYou Are\nYou have spent years deep in the physical design and automation challenges of package substrate products, and you understand how to deliver solutions that work at scale. You have delivered production substrate design methodologies that integrate signal and power integrity requirements. You have built working relationships with foundry and OSAT partners.\nYou think architecturally and can understand and resolve challenges across the data model, implementation engine, DRC engine, or manufacturing readiness. You have demonstrated leadership and direction setting for R&D teams. You can interact with a GM or a customer's most senior technologist because you understand and have solved the hard problems before.\nYou are comfortable with ambiguity at the front end of a project but are able to drive toward clarity fast. At Synopsys, you will help shape the future of 3DIC and package substrate tooling, working with the executive R&D owner for 3DIC and influencing product strategy that affects how the industry designs the next generation of advanced packages.\nWhat You'll Be Doing\nLead R&D projects defining the architectural direction for package substrate design automation, including auto routing, power delivery network analysis, DRC engines, and database models\nDrive new technical solutions beyond incremental features, working directly with the Exec Director R&D owner for 3DIC to influence product roadmap and strategic direction\nDevelop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges at scale\nCollaborate with cross-functional teams on database models, collateral input/output formats like ODB++, and integration with analysis tools for design validation\nPartner directly with foundries and assembly and test companies to implement emerging package substrate technologies and design methodologies, translating manufacturing constraints into tooling requirements\nProvide technical mentorship and architectural guidance to engineering teams, raising the technical bar across substrate design automation projects\nCommunicate complex technical tradeoffs and architectural decisions to senior internal leaders and customer technologists, shaping how Synopsys and the industry approach advanced packaging challenges\nThe Impact You Will Have\nDefine the technical architecture for next-generation package substrate design tools that will be used across the semiconductor industry\nEnable customers to design more complex, higher-performance package substrates by solving automation bottlenecks in routing, power integrity, and design rule validation\nInfluence Synopsys product strategy and R&D investment decisions in the 3DIC and advanced packaging domain\nAccelerate time-to-market for advanced packaging technologies by building tighter collaboration models between EDA tools and manufacturing partners\nRaise the technical capability of engineering teams through mentorship and architectural leadership, creating leverage beyond your individual contributions\nShape industry standards and best practices for package substrate design methodologies through direct engagement with foundries and OSAT partners\nDrive adoption of new Synopsys capabilities in package substrate design, directly affecting customer success in high-stakes production programs\nWhat You'll Need\nDeep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, power delivery network analysis, and design-for-manufacturing\nStrong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software\nProven experience leading R&D projects that resulted in new architectural solutions, not just feature development or flow integration\nExtensive knowledge of computational geometry algorithms and their application to physical design automation problems\nUnderstanding of schematic-driven layout methodologies for package designs and the data models that connect electrical and physical domains\nExperience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation\nFamiliarity with design rule manuals, technology files, and ODB++ output formats for substrate manufacturing and design validation is a strong plus\nBachelor's or Master's degree in Computer Science, Electrical Engineering, or a related field, or equivalent practical experience\nWho You Are\nYou can walk into a technical review with a customer's chief architect or a Synopsys GM and explain a complex design automation tradeoff in two minutes without losing the nuance or the business impact\nYou have a point of view on what good architecture looks like, and you push back when a proposed solution will not scale or does not address the real constraint\nYou move between writing C++ code, reviewing algorithmic approaches, and discussing product strategy with executive leadership without losing context or momentum\nYou mentor engineers by asking the right questions, not by giving answers, and you know when to let someone struggle productively versus when to step in\nYou are comfortable with the ambiguity that comes at the start of a hard R&D problem, and you drive toward architectural clarity without waiting for perfect information\nYou build relationships with external partners like foundries and OSAT companies that go beyond transactional collaboration, you become a trusted technical advisor they call when they hit a wall\nThe Team You'll Be Part Of\nThis position reports into the Executive Director of R&D who owns the 3DIC portfolio at Synopsys, directly influencing technical and product strategy for advanced packaging solutions. Your role will involve collaboration across EDA software development teams, customer-facing application engineering, and external partners including foundries and assembly and test companies. This is a senior technical leadership role with visibility across the organization and direct impact on product direction.\nRewards and Benefits\nWe offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.\nAt Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.\nIn addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.","description_format":"text","description_chars":7697,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":["Equity"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["EDA Software","Application Security","Semiconductor IP & Chip Design Services"],"lifecycle":[{"event":"open","at":"2026-09-26T16:23:53Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 178 · green card filings: 177","filings_12m":178,"filings_prev_12m":208,"green_card_filings_12m":177,"median_offered_wage_usd":157472,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":8}],"liveness":{"score":32,"band":"fade","label":"Fading","p_open":1,"p_active":0.72,"p_room":0.45,"age_days":24,"expected_fill_days":15,"reasons":["conf:2","velocity","win:tail","comp:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":null,"html_url":"https://alion.io/job/synopsys-rd-senior-solutions-architect-package-substrate-eda-18086","json_url":"https://alion.io/job/synopsys-rd-senior-solutions-architect-package-substrate-eda-18086.json","meta":{"generated_at":"2026-10-21T13:14:13Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":18797,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":39954},"rest":"https://alion.io/mcp/rest/get_company?id=39954"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fsynopsys-rd-senior-solutions-architect-package-substrate-eda-18086"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fsynopsys-rd-senior-solutions-architect-package-substrate-eda-18086"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fsynopsys-rd-senior-solutions-architect-package-substrate-eda-18086"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/synopsys-rd-senior-solutions-architect-package-substrate-eda-18086\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fsynopsys-rd-senior-solutions-architect-package-substrate-eda-18086"}]}