{"id":2678889,"url":"https://alion.io/job/techinsights-technical-fellow-advanced-packaging-integration-techinsights","title":"Technical Fellow, Advanced Packaging Integration - TechInsights","company":{"id":15844,"name":"Techinsights","domain":"techinsights.com","url":"https://alion.io/company/techinsights","size_band":"51-200","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"JazzHR","truth_index":null},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Ottawa, Canada"],"countries":["CA"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":99000,"max_usd":173000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":14},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":false},{"name":"TPU","optional":false}],"status":"live","first_seen_at":"2026-10-16T06:03:34Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-19T16:52:31Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"OUR STORY\nTechInsights is the information Platform for the semiconductor industry.\nRegarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry-past, present, or future.\nOver 650 companies and 150,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com.\nWHY WORK WITH US\nCompany-sponsored training and development opportunities\nComprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)\nFlexible vacation policy\nTrusted device reimbursement program \nCommunity involvement opportunities through charitable alliances: https://www.techinsights.com/community-involvement\nWellness resources and support\nInclusive environment that prioritizes diversity, equity, and accessibility\nHigh-growth company driven by high performance\nExpected salary range: $175,000 - $195,000 CAD\nTHE OPPORTUNITY:\nAt TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance.\nThis is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and High Performance Computing. You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.\nYour leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.\nWHAT YOU’LL DO\nLead with Technical Authority\nServe as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration..\nProvide authoritative insights on leading-edge and emerging packaging and system integration technologies, including:2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.\nCo-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC).\nHybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.\n\nOwn and Evolve Technology RoadmapsShape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.\nIdentify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.\nHelp drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.\nAccelerate Content Creation through AI and InnovationLeverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.\nCreate and apply new techniques that connect process flow, packaging design, and system performance metrics.\nAssertively drive content velocity and analytical quality across teams.\nEngage Globally and Lead by InfluenceRepresent TechInsights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions TechInsights at the forefront of semiconductor intelligence.\nMentor analysts, shape analytical methods, and foster cross-domain collaboration between packaging, logic, memory, and system analysis teams.\nTravel internationally to meet with hyperscalers, foundries, fabless companies, and system manufacturers.\n WHAT YOU’LL BRING A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.\nMaster’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.\nAdept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.\nDeeply familiar with one or more of the following domains:Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).\nProcessor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC).\nSystem-level power, thermal, and performance analysis.\n\nDemonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.\nAn effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.\nMotivated by curiosity, collaboration, and a desire to define what comes next in semiconductor analysis.\nWilling to travel globally (up to 25%) to build relationships and represent TechInsights at technical and industry events.\nAs part of the recruitment process for this position, you will be required to submit your latest citizenship and/or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations.\nWORKING ARRANGEMENT\nThis role is on-site at our Ottawa office. Travel may be required up to 25% of the time.\nTechnology knows no bounds, and neither does TechInsights. Bringing together talented humans from different perspectives, backgrounds and abilities is something we take seriously. We’re committed to building an inclusive environment that welcomes you to be your authentic self and allows us to push past the boundaries together.\nTechInsights is committed to meeting the needs of people with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process.\nAI technology may be used to assist in the screening and assessment of applications for this position. Our recruiters are involved at every stage, and all hiring decisions are made by People and hiring teams.\nAs part of any recruitment process, TechInsights collects and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. 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