{"id":1643513,"url":"https://alion.io/job/teradyne-sr-packaging-engineer-teradyne-north-reading-ma","title":"Sr. Packaging Engineer (TERADYNE, North Reading, MA)","company":{"id":58849,"name":"Teradyne","domain":"teradyne.com","url":"https://alion.io/company/teradyne","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":{"grade":"A","score":92,"open_postings":3,"ghost_share":0,"stale_share":0.333,"repost_share":0,"time_to_fill_p50_days":25,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Enterprise Apps","role_family":"Enterprise Apps","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["North Reading, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":175300,"max":280600,"currency":"USD","period":"year","gross":null,"usd_annual":280600},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Advantest / Teradyne ATE","optional":false},{"name":"C#","optional":false},{"name":"C++","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"Cadence Sigrity","optional":false},{"name":"MATLAB","optional":false},{"name":"Perl","optional":false},{"name":"Python","optional":false},{"name":"Visual Basic","optional":false}],"status":"live","first_seen_at":"2026-09-15T07:00:00Z","employer_posted_date":"2026-09-15","last_verified_at":"2026-10-29T14:22:19Z","board_verified":true,"closed_at":null,"days_open":44,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":44},"description":"We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!\nWe attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.\nOur Purpose\nTERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.\nWe cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team - one that makes better decisions, drives innovation and delivers better business results.\nOpportunity Overview\nTeradyne is seeking a Package Design Engineer with signal and power integrity experience to support advanced measurement ASIC products within the Semiconductor Test Division. This role contributes to the physical realization of complex RF, analog, digital, and mixed-signal ASIC products across the chip, package, board, socket, fixture, and system interconnect environment.\nThe Package Design Engineer will provide technical direction for package electrical integrity strategy, package and PCB constraints, supplier design reviews, package substrate and board-level manufacturability tradeoffs, and simulation-to-hardware correlation activities.\nLead ASIC package signal and power integrity architecture, including package stackup strategy, bump and BGA escape planning, return-path control, power-delivery partitioning, and package-to-board co-design.\nDevelop package and PCB layout constraints for high-speed serial links, clocks, DUT IO, power rails, and sensitive analog or mixed-signal interfaces while balancing electrical performance, manufacturability, cost, reliability, and schedule.\nCollaborate with ASIC design, PCB design, mechanical, thermal, test, characterization, manufacturing, procurement, quality, and external package and PCB suppliers to identify and close package-related technical risks.\nBuild and review time-domain and frequency-domain models for package, board, socket, connector, interposer, and fixture interconnect structures, including insertion loss, return loss, crosstalk, mode conversion, skew, impedance discontinuity, and resonances.\nSupport package-level power distribution network planning and review activities, including target impedance, decoupling strategy, current-density review, DC IR drop, AC droop or noise behavior, plane or cavity resonance, extraction strategy, and measurement correlation.\nPartner with substrate, package, PCB fabrication, assembly, and EDA tool suppliers to evaluate design rules, fabrication tolerances, assembly limitations, reliability considerations, and design-for-manufacture/design-for-assembly requirements.\nMentor engineers and contractors in package design methods, SI/PI analysis practices, modeling assumptions, design review preparation, tool workflows, and technical documentation expectations.\nAll About You\nWe seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position.\nMinimum of a Master’s degree in Electrical Engineering, Packaging Engineering, or a closely related technical discipline, or equivalent experience required. PhD or equivalent advanced technical experience preferred.\nExtensive related industry experience in semiconductor package design, package and board interconnect modeling, signal integrity, power integrity, or high-speed mixed-signal hardware development.\nExperience leading SI/PI design and signoff for complex package, board, and system-level interconnects used in high-performance mixed-signal, RF, serial-link, ATE, or semiconductor-test applications.\nStrong knowledge of electromagnetic field theory, transmission-line theory, frequency-domain network analysis, high-speed digital signaling, analog/RF design considerations, package-to-board co-design, and power-distribution-network design.\nExperience with substrate stackup definition, via and escape design, return-path management, differential and single-ended routing, power and ground assignment, bump or BGA mapping, package construction documentation, and supplier DFM rule review.\nExperience with 2D and 3D electromagnetic field solvers and package or board extraction methods. Cadence Sigrity, Clarity, Allegro/APD, Integrity/System Planner, Celsius, Allegro X/Aurora, and related Cadence tool flows are preferred.\nHands-on experience using Vector Network Analyzers, TDR/TDT, high-speed oscilloscopes, probes, fixtures, and coupon structures to validate simulation models and characterize interconnect performance.\nAbility to create package and PCB constraints, signoff criteria, simulation plans, correlation plans, and design-review evidence that can be used across engineering projects and cross-functional teams.\nStrong technical communication, organization, and collaboration skills, including the ability to develop concise design-review materials, risk summaries, requirements documentation, and action-item tracking.\nProgramming or automation experience with Python, Tcl, MATLAB, Perl, C/C++, C#, Visual Basic, or similar tools for data processing, S-parameter handling, simulation automation, test automation, or design-flow efficiency preferred.\nCompensation and Benefits\n\nCompensation: The base salary range for this role is $175,300-$280,600. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.\nIncentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.\nBenefits: Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. 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