{"id":2562948,"url":"https://alion.io/job/texas-instruments-2027-packaging-engineer","title":"2027 Packaging Engineer","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":80,"open_postings":154,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":9,"computed_at":"2026-10-15T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["New Taipei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":11500,"max_usd":22000,"period":"year","method":"role_country_seniority_unknown","sample_n":63},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-18T02:59:38Z","employer_posted_date":"2026-09-18","last_verified_at":"2026-10-15T05:03:56Z","board_verified":true,"closed_at":null,"days_open":27,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":27},"description":"Change the world. Love your job.\nIn your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.\nInterface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!\nPackaging engineers play an important role at TI which encompasses the following responsibilities:\nPartner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness\nParticipate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage\nDirect design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.\nConduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.\nAs a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.\nPut your talent to work with us as a Packaging engineer !\n Minimum Requirements:\nBachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering\nCumulative 3.0/4.0 GPA, or higher\nPreferred Qualifications:\nBasic understanding of statistical process control (SPC)\nSemiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)\nDemonstrated analytical and problem solving skills\nStrong written and verbal communication skills\nAbility to work in teams and collaborate effectively with people in different functions\nStrong time management skills that enable on-time project delivery\nAbility to build strong, influential relationships\nAbility to work effectively in a fast-paced and rapidly changing environment\nAbility to take the initiative and drive for results\nTexas Instruments will not sponsor job applicants for visas or work authorization for this position.","description_format":"text","description_chars":3449,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-14T21:15:20Z"}],"visa":[],"liveness":{"score":7,"band":"cold","label":"Long shot","p_open":1,"p_active":0.204,"p_room":0.35,"age_days":27,"expected_fill_days":9,"reasons":["conf:0","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-10-15T05:46:00Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-2027-packaging-engineer","json_url":"https://alion.io/job/texas-instruments-2027-packaging-engineer.json","meta":{"generated_at":"2026-10-15T06:17:56Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":9415,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-16T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-2027-packaging-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-2027-packaging-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-2027-packaging-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-2027-packaging-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-2027-packaging-engineer"}]}