Career Accelerator Program - Packaging Engineer - PhD
Confirmed on the employer's own hiring board on Oct 16, 2026. First seen by Alion on Oct 14, 2026. Texas Instruments scores B on the Alion truth index.
Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities:
- Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
- Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging engineer !
Minimum Requirements:
- PhD in Material Science, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related
- Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications:
- Coursework or research in semiconductor packaging/fabrication
- Experience with AutoCAD design and FEM modeling
- Strong fundamentals in heat transfer, thermodynamics, and stress analysis
- Experience with Semiconductor MEMS/3D integration design and fabrication
- Project experience in the areas of: CVD, PVD, thin film deposition, electroplating, plasma etch, ML based package design, wafer bumping, or optical packaging
- Experience with plating, adhesion, surface treatment process
- Hands experience with semiconductor fabrication and characterization tools including VI Scopes, X-ray Inspection, materials characterization, and FA techniques
- Strong written and verbal communication skills
- Demonstrated analytical and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results