Die Prep Equipment Engineer (MES Project)

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Die Prep lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1-2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

• MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
• Integration & Data: Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic.
• Validation: Validate integration scenarios and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Minimum Requirements:

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum 2 years of relevant experience

Preferred Qualifications:

• Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome
• Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship