{"id":3289181,"url":"https://alion.io/job/texas-instruments-electromagnetics-em-and-packaging-design-engineer","title":"Electromagnetics (EM) and Packaging Design Engineer","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":75,"open_postings":176,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":31,"computed_at":"2026-11-02T06:13:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Dallas, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":76000,"max_usd":139000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4330},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Ansys HFSS","optional":false},{"name":"Cadence Virtuoso","optional":false},{"name":"Keysight ADS","optional":false}],"status":"live","first_seen_at":"2026-10-26T18:07:02Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-11-02T12:16:20Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.\nKilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.\nAs a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.\nAbout the Position\nKilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D heterogeneously integrated systems. This role is responsible for the RF modeling of new technology platforms and product ideas. The role requires working extensively across other internal teams including advanced process technology development (ATD), packaging, chip design and test, and product engineering, to make innovative, high performance and cost-effective solutions. This position is ideal for individuals interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced/heterogeneous packaging technologies. For this role we are seeking a creative problem-solver who can develop unique and breakthrough solutions.\nResponsibilities may include, but are not limited to:\nDrive and execute the strategy of high frequency and high-speed interconnect simulations for various product developments.\nLead the electromagnetic modeling needs of the team for various applications; such as advanced packages, TSVs, heterogeneously integrated 2.5D/3D systems.\nBuild and analyze electromagnetic models of RF passive structures, including: filters, matching networks, baluns, couplers, RF transitions and interconnects.\nPerform electromagnetic simulations using tools such as HFSS and EMX\nWith extracted S-parameters, run circuit and system-level simulations.\nInvestigate RF interactions between the circuits, package structures, and passive components.\nDrawing mask layouts for test structures for proof-of-concept studies, as well as supporting technology development activities\nEvaluate design trade-offs related to performance, and manufacturability.\n Minimum Requirements:\nMaster’s/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science. \n3+ years of industry experience on EM design \nUnderstanding S-parameters and impedance matching \nExperience with semiconductor technologies (CMOS, BiCMOS, GaAs, InP, etc..) and basic understanding of standard back-end-of-line (BEOL) stack-ups\nFamiliar to one or more of the following software packages: Ansys HFSS, Keysight ADS, EMX, Cadence Virtuoso\nBasic experience on layout drawing \nBasic experience of RF measurements\nAbility to work independently and lead cross-functional collaboration between process, fab, and design teams.\nPreferred Qualifications:\nUnderstanding of RF and microwave circuits, electromagnetic theory, analog and RF integrated circuit design\nKnowledge of RF Filter design \nKnowledge of microelectronic fabrication and advanced packaging technologies \nKnowledge of high-speed PCB design \nStrong verbal 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