{"id":2460048,"url":"https://alion.io/job/texas-instruments-packaging-engineer-high-voltage-high-power","title":"Packaging Engineer | High Voltage & high power","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":80,"open_postings":154,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":9,"computed_at":"2026-10-15T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":61000,"max_usd":110000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":3735},"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-13T16:18:21Z","employer_posted_date":"2026-10-13","last_verified_at":"2026-10-15T12:57:16Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Change the world. Love your job.\nAs a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.\nResponsibilities may include:\nTo define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.\nThe candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.\nThe candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.\nThe candidate will develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing.\nThe candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.\nThe candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps.\nThe candidate must be a proven leader, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.\n Minimum Requirements:\nMaster's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree\n2+ years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies\nHands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules)\nStrong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools\nPreferred Requirements:\nExcellent communication skills and ability to work with internal and external customers to define and develop roadmaps\nPrior experience scaling HV packages and modules from concept to high volume manufacturing\nGood understanding of clip attach, flip chip packaging and overview of wafer bumping processes \nKnowledge of magnetics and high power density enterprise power modules (6V - 48V) is a plus \nStrong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)\nGood understanding of industry & subcon HV packaging capabilities & roadmaps\nOverview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving\nTrack record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies","description_format":"text","description_chars":3287,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Power Grid","Processors, MCUs & AI Chips","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-13T17:11:14Z"}],"visa":[],"liveness":{"score":62,"band":"ok","label":"Likely open","p_open":1,"p_active":0.62,"p_room":1,"age_days":1,"expected_fill_days":9,"reasons":["conf:0","stale_co","velocity","win:early","comp:junior,brand"],"computed_at":"2026-10-15T05:46:00Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-packaging-engineer-high-voltage-high-power","json_url":"https://alion.io/job/texas-instruments-packaging-engineer-high-voltage-high-power.json","meta":{"generated_at":"2026-10-15T14:16:17Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":21832,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-16T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-packaging-engineer-high-voltage-high-power"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-packaging-engineer-high-voltage-high-power"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-packaging-engineer-high-voltage-high-power"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-packaging-engineer-high-voltage-high-power\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-packaging-engineer-high-voltage-high-power"}]}