{"id":3253502,"url":"https://alion.io/job/texas-instruments-packaging-engineer-hv-gan-module","title":"Packaging Engineer - HV GaN module","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":76,"open_postings":197,"ghost_share":0,"stale_share":0.959,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-11-04T06:34:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-25T11:16:01Z","employer_posted_date":"2026-10-25","last_verified_at":"2026-11-04T02:49:46Z","board_verified":true,"closed_at":null,"days_open":9,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":9},"description":"The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for HV GaN module development engineer\nResponsibilities:\nDesign, develop, and characterize high voltage (200-1200V) packages and high-power modules targeting AI infrastructure and Industrial market\nUnderstand market trends and end equipment system requirements and translate these into package design specifications.\nDefine packaging solutions across HV technologies including GaN, SiC, IGBT, and Isolation Technologies; validate designs using CAD, thermomechanical, and electrical parasitic extraction tools.\nWork with material suppliers (mold compounds, die attach, substrates) to qualify materials meeting HV application requirements.\nCollaborate with cross-functional teams across sites to support development and ramp of new products.\n Minimum Qualifications:\nMS degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.\n5+ years of hands-on experience in high voltage (200V-1200V) or high-power semiconductor packaging across GaN, SiC, IGBT technologies.\nHands-on experience with HV package and power module design, materials, and assembly flow integration (molded packages such as TOLT, TOLG, Q-DPAK, DIP, SIP and case modules).\nFamiliarity with HV Bill of Materials including mold compounds, die attach, and DBC substrates.\nExperience with stress, thermal, and electrical parasitic modeling tools.\nUnderstanding of HV discrete and power module reliability and qualification requirements; ability to support qualification activities and contribute to problem solving.\nGood communication skills; able to work effectively with internal teams and external suppliers.\nProficiency in English and Japanese.\nPrior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.\nExperience in presenting technical work at internal reviews or industry conferences\nWorking knowledge of clip attach, flip chip packaging, and wafer bumping processes.\nPreferred Qualifications:\nPrior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.\nExperience in presenting technical work at internal reviews or industry conferences\nWorking knowledge of clip attach, flip chip packaging, and wafer bumping processes.","description_format":"text","description_chars":2296,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"Japanese","level":"Advanced (C1)","optional":false},{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Consumer Electronics","Electrical & Electronic Engineering","Semiconductor Manufacturing","Email Security"],"lifecycle":[{"event":"open","at":"2026-10-25T23:40:40Z"}],"visa":[],"liveness":{"score":57,"band":"ok","label":"Likely open","p_open":1,"p_active":0.631,"p_room":0.9,"age_days":9,"expected_fill_days":28,"reasons":["conf:3","stale_co","velocity","win:mid","comp:brand"],"computed_at":"2026-11-04T06:34:25Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-packaging-engineer-hv-gan-module","json_url":"https://alion.io/job/texas-instruments-packaging-engineer-hv-gan-module.json","meta":{"generated_at":"2026-11-04T08:09:02Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":12726,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-05T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-packaging-engineer-hv-gan-module"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-packaging-engineer-hv-gan-module"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-packaging-engineer-hv-gan-module"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-packaging-engineer-hv-gan-module\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-packaging-engineer-hv-gan-module"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3253502}},{"tool":"search_jobs","arguments":{"company":"ti.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3253502},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); 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