Packaging Engineer - Inductor and Power module

The Emerging Packaging Technologies at Texas Instruments is looking for a candidate forInductor and Power module development engineer

Responsibilities:

• Design and develop ultra-compact, high-density, high current (100-300A) power delivery modules targeting enterprise and AI infrastructure applications.
• Understand market trends and end equipment system requirements and translate these into package design specifications.
• Work with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements.
• Ensure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration.
• Collaborate with cross-functional teams across sites to support development schedules and time-to-market targets.

Minimum Qualifications:

• MS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging.
• 5+ years of hands-on experience in inductor design or package development.
• Working knowledge of power delivery architectures, thermal management, EMI, and reliability constraints.
• Good understanding of magnetic material types.
• Familiarity with material characterization techniques (BH analyzer, VSM, SEM, EDX).
• Understanding of material processing for ceramic, metal powder, and composite materials.
• Familiarity with inductor coil forming and termination processes: wire wound, multilayer, metal composite, thin film, etc.
• Good communication skills; able to work effectively with internal teams and external suppliers.
• Proficiency in English and Japanese.

Preferred Qualifications:

• Hands-on experience with simulation tools such as Maxwell, Ansys, or Femtet; familiarity with homogenization, model order reduction, and optimization techniques (NN, AI/ML a plus).
• Prior contributions to patents or publications in magnetics, packaging, or passive integration.
• Familiarity with magnetic supplier capabilities and emerging research directions.