{"id":3253503,"url":"https://alion.io/job/texas-instruments-packaging-engineer-inductor-and-power-module","title":"Packaging Engineer - Inductor and Power module","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":75,"open_postings":176,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":31,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":true}],"status":"live","first_seen_at":"2026-10-25T11:15:42Z","employer_posted_date":"2026-10-25","last_verified_at":"2026-11-01T21:22:50Z","board_verified":true,"closed_at":null,"days_open":7,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":7},"description":"The Emerging Packaging Technologies at Texas Instruments is looking for a candidate forInductor and Power module development engineer\nResponsibilities:\nDesign and develop ultra-compact, high-density, high current (100-300A) power delivery modules targeting enterprise and AI infrastructure applications.\nUnderstand market trends and end equipment system requirements and translate these into package design specifications.\nWork with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements.\nEnsure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration.\nCollaborate with cross-functional teams across sites to support development schedules and time-to-market targets.\n Minimum Qualifications:\nMS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging.\n5+ years of hands-on experience in inductor design or package development.\nWorking knowledge of power delivery architectures, thermal management, EMI, and reliability constraints.\nGood understanding of magnetic material types.\nFamiliarity with material characterization techniques (BH analyzer, VSM, SEM, EDX).\nUnderstanding of material processing for ceramic, metal powder, and composite materials.\nFamiliarity with inductor coil forming and termination processes: wire wound, multilayer, metal composite, thin film, etc.\nGood communication skills; 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