{"id":3345097,"url":"https://alion.io/job/texas-instruments-packaging-engineer","title":"Packaging Engineer","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":75,"open_postings":176,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":22,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Dallas, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":85000,"max_usd":160000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":6333},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-27T12:05:33Z","employer_posted_date":"2026-10-27","last_verified_at":"2026-10-30T23:07:39Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"Change the world. Love your job.\nAs a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Package Technology Solutions organization.\nResponsibilities include:\nDevelop and enhance substrates, mold compound, and other packaging materials for power devices with focus on datacenter and automotive applications\nCollaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices\nCo-design and qualify new power packages and capabilities with various product groups\nPerform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability\nUtilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs\nCoordinate the introduction of new package processes into production at internal/external AT sites\nPrepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies Qualifications\nWork with failure analysis team to improve designs and processes\n Minimum requirements:\nBachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering or related Engineering field of study\n5+ years of experience working as an Engineer on projects with substantial packaging activities\nPreferred qualifications:\nAbility to perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability\nAbility to design packages with emphasis on power efficiency \nUnderstanding of inductor design and manufacturing\nAbility to work with assembly sites to ramp new processes\nUnderstand of manufacturing impact on quality\nUnderstanding of best practice to ensure supplier 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