{"id":2605576,"url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-leadframe-packageceramic","title":"Senior Packaging Development Engineer - Leadframe Package/Ceramic","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":80,"open_postings":154,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":9,"computed_at":"2026-10-15T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":34000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":7404},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-15T08:31:04Z","employer_posted_date":"2026-10-15","last_verified_at":"2026-10-15T20:27:04Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"Packaging Engineer\nAbout TI\nTexas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future - from the responsible manufacturing of our semiconductors to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us - change the world, love your job!\nAbout the job\nAs a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.\nPut your talent to work with us as a Packaging engineer - change the world, love your job!\nResponsibilities include:\nHands on or optimizing FOL process such as Face2Face Flip Chip & Reflow process as well as swivel molding characterization for dual side cooling MCM package \nDefining simplified FOL and EOL manufacturing process sequence for power stage package\nManaging multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc.\nCollaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements \nEngaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs\nEnabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology. \nWork with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.\n Minimum requirements:\nBachelor’s Degree in Mechanical Engineering, Physics, Material Science, or a related field of study \nCumulative > 3.3 CGPA and above\nMinimum 5 years-experience in the manufacturing semiconductor field\nExpert level experience in process development for power stage, multi chip module\nPackage layer design expertise such as structural configuration, material selection and process flow design \nHands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement\nExpert experience of using ANSYS / FEA for stress modeling\n\nPreferred qualifications:\nAbility to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.\nHands on experience on system-in-Package (SiP), including multi chip package or package on package is added advantage.\nKnowledge of power stage packaging design, including understanding of Design for Manufacturability (DFM) constraints and defect criteria.\nExperience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)\nAbility to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution\nBroad and deep technical understanding of leadframe / DBC / MIS manufacturing.\nKnowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage\nExperience with assembly of power modules packaging, substrate design and reliability requirements\nProject management experience in semiconductor industry specifically in Assembly Test or SMT Operation\nKey personal characters - trustworthy, inclusive, innovative, competitive, result-oriented","description_format":"text","description_chars":4081,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-15T09:25:00Z"}],"visa":[],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":0,"expected_fill_days":9,"reasons":["conf:1","win:early","comp:brand"],"computed_at":"2026-10-15T22:23:19Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-leadframe-packageceramic","json_url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-leadframe-packageceramic.json","meta":{"generated_at":"2026-10-15T22:23:19Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":33979,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-16T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-senior-packaging-development-engineer-leadframe-packageceramic"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-senior-packaging-development-engineer-leadframe-packageceramic"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-senior-packaging-development-engineer-leadframe-packageceramic"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-senior-packaging-development-engineer-leadframe-packageceramic\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-senior-packaging-development-engineer-leadframe-packageceramic"}]}