{"id":2605575,"url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-substrate-modules","title":"Senior Packaging Development Engineer - Substrate Modules","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":80,"open_postings":166,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":8,"computed_at":"2026-10-16T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":34000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":7404},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-15T08:47:22Z","employer_posted_date":"2026-10-15","last_verified_at":"2026-10-16T09:00:18Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Change the world. Love your job.\nAs a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.\nResponsibilities may include:\nOptimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology \nDefining simplified manufacturing process sequence for different components attach\nManaging multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation\nCollaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements \nEngaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs\nEnabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment\n Minimum requirements:\nBachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study\nCumulative > 3.3 CGPA and above\nMinimum 5 years' experience in the manufacturing semiconductor field\nHands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement\nPreferred qualifications:\nPackage layer design expertise such as structural configuration, material selection and process flow design \nAbility to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.\nHands on experience on system-in-Package (SiP), including exposed Inductor integration solutions is added advantage.\nKnowledge of power module packaging processes, including understanding of Design for Manufacturability (DFM) constraints and module package defect criteria.\nExperience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)\nAbility to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution\nBroad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.\nKnowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage\nExperience with assembly of power modules packaging, substrate design and reliability requirements\nProject management experience in semiconductor industry specifically in Assembly Test or SMT Operation\nKey personal characters - trustworthy, inclusive, innovative, competitive, result-oriented","description_format":"text","description_chars":2921,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-15T09:25:00Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":0,"expected_fill_days":8,"reasons":["conf:2","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-16T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-substrate-modules","json_url":"https://alion.io/job/texas-instruments-senior-packaging-development-engineer-substrate-modules.json","meta":{"generated_at":"2026-10-16T10:07:18Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":48,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-17T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-senior-packaging-development-engineer-substrate-modules"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-senior-packaging-development-engineer-substrate-modules"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-senior-packaging-development-engineer-substrate-modules"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-senior-packaging-development-engineer-substrate-modules\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-senior-packaging-development-engineer-substrate-modules"}]}