{"id":2226726,"url":"https://alion.io/job/texas-instruments-wire-bond-die-attach-equipment-engineer-mes-project","title":"Wire Bond & Die Attach Equipment Engineer (MES Project)","company":{"id":36400,"name":"Texas Instruments","domain":"ti.com","url":"https://alion.io/company/texas-instruments","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":80,"open_postings":172,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":8,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Enterprise Apps","role_family":"Enterprise Apps","seniority":"junior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Kuala Lumpur, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-09-28T11:56:24Z","employer_posted_date":"2026-10-19","last_verified_at":"2026-10-22T02:19:38Z","board_verified":true,"closed_at":null,"days_open":23,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":23},"description":"Change the world. Love your job.\nJoin TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1-2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.\nKey Responsibilities:\nMES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.\nIntegration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.\nValidation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.\nSustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.\n Minimum Requirements:\nMinimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree\nStrong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience \nPreferred Qualifications:\nEquipment experience with ASM and KNS\nExperience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration\nWorking awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early\nExperience on tool monitoring and interdiction software, and equipment maintenance and documentation\nWorking knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.\nStrong verbal and written communication skills\nDemonstrated strong analytical, critical thinking and problem solving skills\nAbility to work in teams and collaborate effectively with people in different functions\nAbility to take the initiative and drive for results\nStrong time management skills that enable on-time project delivery\nAbility to work effectively in an interrupt-driven, fast-paced and rapidly changing environment\nDemonstrated ability to build strong, influential relationship","description_format":"text","description_chars":2749,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-10T16:41:48Z"}],"visa":[],"liveness":{"score":9,"band":"cold","label":"Long shot","p_open":1,"p_active":0.253,"p_room":0.35,"age_days":22,"expected_fill_days":8,"reasons":["conf:1","stale_co","velocity","win:tail","comp:junior,brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":null,"html_url":"https://alion.io/job/texas-instruments-wire-bond-die-attach-equipment-engineer-mes-project","json_url":"https://alion.io/job/texas-instruments-wire-bond-die-attach-equipment-engineer-mes-project.json","meta":{"generated_at":"2026-10-22T04:29:11Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":4869,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":36400},"rest":"https://alion.io/mcp/rest/get_company?id=36400"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Ftexas-instruments-wire-bond-die-attach-equipment-engineer-mes-project"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Ftexas-instruments-wire-bond-die-attach-equipment-engineer-mes-project"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Ftexas-instruments-wire-bond-die-attach-equipment-engineer-mes-project"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/texas-instruments-wire-bond-die-attach-equipment-engineer-mes-project\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Ftexas-instruments-wire-bond-die-attach-equipment-engineer-mes-project"}]}