{"id":3942838,"url":"https://alion.io/job/ttm-technologies-inc-pd-lead-engineer","title":"P&D Lead Engineer","company":{"id":2822196,"name":"TTM Technologies Inc.","domain":"ttm.com","url":"https://alion.io/company/ttm-com","size_band":null,"is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Dongguan, China"],"countries":["CN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-07T00:00:00Z","employer_posted_date":"2026-09-07","last_verified_at":"2026-11-08T21:08:10Z","board_verified":true,"closed_at":null,"days_open":62,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":62},"description":"TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer\nAbout TTM\nTTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.\nAdditional information can be found at www.ttm.com\n工作职责：\n1. 关注制造领域的PCB技术动态，定期向内部团队提供技术信息\n2. 了解客户的产品路线图、PCB设计特性和制造需求，以探索技术发展\n3. 管理HDI或mSAP PCB的技术开发项目，以在高速应用领域保持前瞻竞争力\n4. 与客户合作，早期参与产品开发，并协助工厂工程开展能力建设\n5. 与多个职能部门合作部署技术差异化\n任职要求：\n1. 工程、化学、材料科学或相关专业的学士学位。硕士优先\n2. 至少10年印刷电路板（PCB）行业经验，涉及高速/高频电子产品、HDI或mSAP PCB、CCL覆铜板或化学领域; 具有研发背景者优先。\n3. 项目管理经验\n4. 优秀的沟通能力（英语、中文）\n5. 熟悉HDI或mSAP制造工艺及DFM规则\n6. 了解制造对PCB级信号完整性性能的影响\n7. 致力于理解并与同事及跨职能团队清晰沟通\nCompensation and Benefits:\nApplicants may be entitled to:\nMandatory Statutory Benefits according to the laws and legislation\n\nStaff dormitory, Dining hall, Gym room, Company Shuttle, and other supportive facilities and services for those living on-site\n\nOccupational health check-ups, Shuttle bus, Supplementary housing allowance (those not in dorms), Meal subsidy, etc.\n\nLabor unions or other kinds of associations of interest, rich recreational activities such as company Annual Dinners, holiday gifts and greetings, team building, and various social activities.\n\nSystematic training courses, Development projects, and Career paths\n\nExport Statement:\nMust comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; 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