{"id":3262721,"url":"https://alion.io/job/umc-technology-development-thin-film-process-engineer","title":"Technology Development Thin Film Process Engineer","company":{"id":62230,"name":"UMC","domain":"umc.com","url":"https://alion.io/company/umc","size_band":null,"is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":null,"truth_index":null},"role":"Semiconductors","role_family":"Semiconductors","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":4400,"max":7000,"currency":"SGD","period":"month","gross":true,"usd_annual":65736},"salary_estimate":null,"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"PVD","optional":false},{"name":"ALD","optional":true},{"name":"C++","optional":true},{"name":"Design of Experiments","optional":true},{"name":"FMEA","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-10-26T00:00:00Z","employer_posted_date":null,"last_verified_at":"2026-10-26T00:00:00Z","board_verified":false,"closed_at":null,"days_open":1,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":1},"description":"About the role\nUMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.\nKey responsibilities\nDeveloping and optimizing wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding and debonding processes.\n\nEvaluating and selecting suitable carriers, mounting materials, and associated processes.\n\nDeveloping backside and wafer-bevel film deposition processes.\n\nDeveloping low-temperature dielectric deposition processes.\n\nDeveloping micro-bump (µ-bump) metallization processes, including physical vapor deposition (PVD) and electrochemical plating (ECP).\n\nDefining process specifications, conducting experiments, analyzing data, and resolving process integration and yield issues.\n\nCollaborating with cross-functional teams to improve process performance, reliability, manufacturability, and production readiness.\n\nAbout you\nBachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics\n\nDemonstrated experience of at least 2 years in semiconductor foundry module process\n\n22/28 nanometer and below advance technology nodes experience is highly desirable\n\nStrong understanding of process development, optimization and troubleshooting\n\nProven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer\n\nAbility to analyze complex process issues, identify root causes, and implement effective solutions\n\nExperience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred\n\nAble to commit shift work\n\nAbout us\nUMC is a leading global semiconductor foundry company.\nSkills\nAtomic Layer Deposition, Electrochemical Techniques, Data Analysis, Product Design, Design of Experiments, Process Integration, W2, Product Engineering, Cross Functional Team Building, Airline Distribution Channel Strategies, Characterization, Wafer Fabrication, Silicon, C++, PVD, Metal Processing","description_format":"text","description_chars":2337,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-26T06:28:50Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring 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