{"id":420735,"url":"https://alion.io/job/universal-quantum-advanced-assembly-engineer-2-5-3d","title":"Advanced Assembly Engineer (2.5-3D)","company":{"id":51526,"name":"Universal Quantum","domain":"universalquantum.com","url":"https://alion.io/company/universal-quantum","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workable","truth_index":{"grade":"A","score":96,"open_postings":12,"ghost_share":0,"stale_share":0.167,"repost_share":0,"time_to_fill_p50_days":56,"computed_at":"2026-10-08T05:49:30Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":28000,"max_usd":66000,"period":"year","method":"role_country_seniority_unknown","sample_n":914},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-08-05T00:00:00Z","employer_posted_date":"2026-08-05","last_verified_at":"2026-10-09T02:04:07Z","board_verified":true,"closed_at":null,"days_open":65,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":65},"description":"At Universal Quantum, we aim to make the world a better place by developing a new computer technology. Together, we are creating truly impactful quantum computers. Our machines will be capable of solving problems until now considered impossible, with applications ranging across a broad range of industries, including healthcare, materials and aerospace.\nWe are looking to hire an Advanced Assembly Engineer (2.5-3D) to develop, design, advanced assembly methods for quantum computers. Passionate about helping create technologies which can change the world? We may be the right place for you, so get in touch!\nWhat You’ll Accomplish\nDevelop assembly flows for various quantum computing devices \nDrive methodology, innovation, and productivity improvements in assembly development internally and with external vendors \nInitiate assembly concepts and lead advanced IC assembly development leveraging 2.5D and 3D assembly technologies \nSelect and manage external partners to ensure successful execution \nRequirements\nThe 3 Most Critical Attributes We’ll Use to Compare Candidates\nDeep Technical Expertise in semiconductor assembly, including 2.5D/3D integration and advanced IC assembly technologies \nProblem-Solving Ability with strong engineering fundamentals and experience resolving complex reliability and performance challenges \nInnovation and Leadership in driving new methodologies, collaborating with vendors, and improving design flows and productivity \nMust-have Skills\nSemiconductor assembly experience, including wafer-level 2.5D/3D packaging \nDesign for Excellence (DFM, DFT) experience \nKnowledge of common package technologies and materials \nFamiliarity with CAD tools and thermo-mechanical simulation. \nFinite Element Modeling (FEM) for thermal, electrical, and mechanical simulations \nAbility to resolve assembly reliability issues across wide temperature ranges \nUnderstanding semiconductor assembly manufacturing and packaging/assembly failure mechanisms \nStrong engineering problem-solving skills with solid physics fundamentals \nPhD/master's degree in mechanical engineering, material science, physics, packaging, or micro/nanofabrication\nNice-to-have Skills\nDevelopment of technology PDKs \nKnowledge of Through-Silicon Via (TSV), silicon processing, and thin-film techniques \nElectro-mechanical testing at cryogenic temperatures \nHigh-voltage/power package qualification experience \nProcess engineering 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