{"id":420739,"url":"https://alion.io/job/universal-quantum-semiconductor-package-development-engineer","title":"Semiconductor Package Development Engineer","company":{"id":51526,"name":"Universal Quantum","domain":"universalquantum.com","url":"https://alion.io/company/universal-quantum","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workable","truth_index":{"grade":"A","score":89,"open_postings":9,"ghost_share":0,"stale_share":0.222,"repost_share":0,"time_to_fill_p50_days":99,"computed_at":"2026-11-03T05:54:40Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Tokyo, Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-06-16T00:00:00Z","employer_posted_date":"2026-06-16","last_verified_at":"2026-11-04T00:24:20Z","board_verified":true,"closed_at":null,"days_open":141,"trust":{"level":"ok","repost_count":0,"flags":[],"days_open":140},"description":"At Universal Quantum, we aim to make the world a better place by engineering the future of computing. Together, we are creating truly impactful quantum computers. Our machines will be capable of solving problems until now considered impossible, with applications across healthcare, advanced materials, aerospace and beyond.\nAs we expand our engineering presence in Japan, we are looking for a Semiconductor Package Development Engineer to help realise truly scalable quantum computers. This role will drive the development of advanced semiconductor packaging solutions for next-generation quantum microchips, working at the intersection of materials science, microfabrication and quantum technology.\nWhat You’ll Accomplish:\nYou will initiate packaging concepts and drive advanced IC package development leveraging ceramic package technology to support next-gen quantum microchips. \nYou will drive methodology, innovations, and productivity improvements in package development both internally and with external vendors. \nYou will develop packages for testing in silicon for a variety of extreme environments, such as cryogenic and low vacuum. \nRequirements\nMust-have Skills\nBusiness-level Japanese and English communication skills, with the ability to lead technical discussions, documentation, and supplier interactions in both languages. \nPackage design and layout capabilities \nSemiconductor Package Experience \nMicro-assembly techniques and materials processing knowledge \nUse of CAD tools and Thermo-mechanical Simulation. \nFinite Element Modelling (FEM) thermal, electrical and mechanical simulations. \nExperience in testing methodology for Electro-mechanical testing of IC packaging. \nImplement ‘Design for X’ in the package. \nResolving package reliability issues, especially over a large temperature range. \nUnderstanding of semiconductor assembly manufacturing \nKnowledge in packaging failure mechanism and understanding mechanical and thermal stresses \nGood general engineering problem solving skills with strong engineering physics and fundamentals \nPhD / senior expertise in mechanical engineering, material science, physics, packaging, micro/nanofabrication or similar required \nNice-to-have Skills:\nKnowledge of Through Silicon Via, Silicon processing techniques, Thin Film Processing. \nExperience with 2.5/3D packaging methods \nElectro-Mechanical testing at Cryo-temperatures \nLow outgassing/ Ultra High Vacuum compatibility experience \nHigh voltage/power package qualifications. \nProcess engineering experience. \nAdvanced package assembly experience","description_format":"text","description_chars":2564,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"Japanese","level":"Upper-Intermediate (B2)","optional":false},{"language":"English","level":"Upper-Intermediate (B2)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Quantum Science & Computing","Quantum Computing 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