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Salary
≈ $51k – $82k per year (Estimated)
Location
In office (Newport)
Seniority
Senior · 5+ years exp
Visa
Licensed UK visa sponsor
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 15, 2026. First seen by Alion on Oct 14, 2026.

Overview
Company
Impact
Profile match
Vishay Intertechnology is a manufacturer of discrete semiconductors and passive electronic components headquartered in Malvern, Pennsylvania, making diodes, MOSFETs, optoelectronics, resistors, capacitors, inductors and sensors. Founded in 1962 and listed on the New York Stock Exchange, it serves automotive, industrial, computing, telecommunications, military, aerospace and medical markets from plants in the Americas, Europe, Israel and Asia. It hires production operators and supervisors, process, quality and device engineers, including silicon carbide specialists, along with buyers and commodity leads.

This position is a key member of the SiC Process Engineering team, with responsibility for the development, qualification, industrialisation and ongoing improvement of Laser Anneal, Back Metal and Backgrind processes.

The role will provide technical ownership of these process modules, supporting the development and transfer of new SiC technologies from R&D into manufacturing. The Process Engineer will ensure that robust process controls, specifications, documentation and manufacturing systems are established to support qualification, production ramp-up and sustained process performance.

Role purpose

The SiC Process Engineer will contribute to the success of Vishay by working collaboratively with R&D, Engineering, Production, Equipment Engineering, Quality and New Product Introduction teams to develop advanced and robust manufacturing processes for SiC power devices.

The role will involve the design, development and qualification of SiC wafer fabrication processes, with particular focus on Laser Anneal, Back Metal and Backgrind process modules.

Key duties and responsibilities

  • Develop, qualify and optimise SiC wafer process modules, with primary focus on Laser Anneal, Back Metal Deposition and Backgrind.
  • Provide clear technical ownership of assigned processes and equipment sets.
  • Plan and execute major process-development and process-integration.
  • Design and execute structured experiments and analyse the resulting process, metrology and electrical data.
  • Define, document and maintain process specifications, operating windows, design rules and structural and electrical requirements.
  • Support the transfer of new technologies and products from R&D into manufacturing, including qualification and production ramp-up.
  • Identify and implement process improvements relating to capability, yield, quality, cycle time, cost and equipment utilisation.
  • Establish robust process-control strategies, including appropriate qualification checks, inline measurements, control limits and statistical process control charts.
  • Monitor process performance and lead structured investigations into process deviations, defects and excursions.
  • Develop and maintain technical documentation, including operating specifications, product-introduction reports, FMEAs, OCAPs, control plans and qualification reports.
  • Provide effective technical communication through reports, presentations, production updates and cross-functional reviews.
  • Support and provide technical guidance to shift personnel and other engineering teams as required.
  • Maintain awareness of relevant semiconductor technologies, equipment developments and industry best practices.

Qualifications and education

Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemistry or a related discipline, together with at least five years’ semiconductor process-engineering or process-development experience; or Master’s degree / PhD in a relevant discipline, together with at least three years’ semiconductor process-engineering or process-development experience.

Experience and skills

  • Experience within a semiconductor wafer-fabrication environment.
  • Practical experience in developing, qualifying or sustaining wafer-fabrication process modules.
  • Experience with SiC power-device manufacturing, wide-bandgap semiconductor processing or comparable advanced wafer-fabrication technologies is highly advantageous.
  • Knowledge of semiconductor devices, wafer-fabrication processes and industrial semiconductor manufacturing.
  • Previous process or equipment ownership experience in one or more relevant module areas, ideally including Back Metal Deposition, Laser Anneal or Wafer Thinning.
  • Ability to design structured experiments and interpret process, metrology and electrical data.
  • Understanding of process control and continuous-improvement methods, including SPC, FMEA, OCAP, Kaizen, TPM and structured problem-solving.
  • Ability to investigate technical issues methodically and implement robust corrective and preventive actions.
  • Strong written and verbal communication skills, including preparation of technical reports and presentations.
  • Ability to work effectively across R&D, Engineering, Production and Quality functions.
  • Self-motivated, results-oriented and capable of working both independently and collaboratively.
  • Ability to exercise sound technical judgement within the assigned area of responsibility.
  • Flexibility to support manufacturing and qualification activities outside normal working hours when reasonably required.

Why work for us?

  • Salary based on skills and experience
  • Funded training and development at all levels, including opportunities up to master’s-degree level
  • Annual bonus scheme
  • Medical cover options
  • Competitive Smart Pension contributions
  • Life assurance equivalent to four times annual salary
  • Free employee assistance programme
  • On-site fitness centre
  • Sports and social clubs
  • Retail, sports and entertainment discounts
  • On-site restaurant and outdoor gardens
  • Free on-site parking
  • Career-development opportunities
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