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Salary
≈ $12k – $32k per year (Estimated)
Location
In office (Kuala Lumpur)
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 10, 2026. First seen by Alion on Jun 5, 2026. XPeng scores B on the Alion truth index.

Overview
Company
Impact
Profile match
XPeng is a Chinese smart electric vehicle maker headquartered in Guangzhou, Guangdong, developing its own driver-assistance software, AI chips, electric powertrains and in-car operating systems for models such as the P7, G6, G9, X9 and MONA M03. Founded in 2014 by He Xiaopeng and partners, it listed in New York in 2020 and Hong Kong in 2021, passed one million cumulative deliveries by the end of 2025, sells in about 60 countries, and is developing the IRON humanoid robot and flying cars through affiliate Aridge. It hires AI algorithm, autonomous driving, chip and vehicle engineers, product managers, and international sales and finance staff.

岗位职责 / Responsibilities

1.Vendor & Production Management: Act as the primary interface with external packaging and testing factories (OSATs). Manage production schedules, capacity planning, quality control, and yield improvement to ensure the successful and timely delivery of chip products.

2.Quality Assurance: Formulate end-to-end quality assurance plans for the packaging and testing phases. Conduct process audits and manage quality control to guarantee the success of mass production.

3.Continuous Improvement: Collect and analyze operational and project data. Identify bottlenecks, drive cross-functional issue resolution, and continuously optimize local operational workflows and supply chain efficiency.

4.Government Relations & Compliance: Build and liaise robust relationships with relevant Malaysian government departments, local authorities, and industry bodies. Ensure corporate regulatory compliance, secure necessary operational permits, and facilitate the smooth establishment and daily operations of the company.

任职要求 / Requirements

1.Education: Bachelor’s degree or above in Microelectronics, Electronic Engineering, Automation, Computer Science, or related technical fields.

Industry Experience: 5+ years of operational or project management experience in the semiconductor industry, with a strong, specific background in chip packaging and testing (OSAT) management and successful mass production track records.

2.Technical Knowledge: Deep understanding of semiconductor backend processes, including advanced packaging technologies, testing methodologies, and relevant quality control standards.

3.Local Expertise: Proven experience in government relations, public affairs, or corporate setup. Familiarity with Malaysia's local business environment, regulatory policies, and administrative procedures is highly preferred.

4.Soft Skills: Highly proactive and responsible, with exceptional negotiation, cross-cultural communication, coordination, and risk management capabilities. Able to thrive in a fast-paced, setup-phase environment.

5.Language: Fluent in both written and spoken English and Mandarin (essential for seamless communication with the headquarters). Proficiency in Malay is a strong advantage.

6.Tools: Proficient in mainstream project management and operational tools.

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