{"id":2001330,"url":"https://alion.io/job/xscape-photonics-senior-photonics-packaging-engineer","title":"Senior Photonics Packaging Engineer","company":{"id":3862680,"name":"Xscape Photonics","domain":"xscapephotonics.com","url":"https://alion.io/company/xscapephotonics","size_band":"51-200","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Greenhouse","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Santa Clara, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":104000,"max_usd":197000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":5037},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AI Agents","optional":false},{"name":"SolidWorks","optional":false}],"status":"live","first_seen_at":"2026-08-12T21:22:12Z","employer_posted_date":"2026-08-27","last_verified_at":"2026-10-13T07:37:45Z","board_verified":true,"closed_at":null,"days_open":61,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":61},"description":"About Xscape Photonics \nXscape Photonics is helping customers escape the scaling limits of Agentic AI hardware by enabling machines to think faster. Spun out of groundbreaking silicon photonics work at Columbia University, the company has developed a scalable multi-color laser platform to solve the escape bandwidth bottlenecks limiting GPU-to-GPU and GPU-to-memory interfaces. With a leadership team having multiple decades of experience shipping photonics products and backed by investors including Nvidia and Cisco, the company has recently begun sampling its first technology validation kits and is currently engaged with pilot customers for its first product launch.\nAbout the Role\nWe’re seeking a seasoned Photonics Packaging Engineer to lead the design,\ndevelopment, and integration of advanced photonic components-specifically lasers,\nPICs, and SOAs-into high-performance optoelectronic modules. This role is pivotal in\ndriving innovation in next-generation optical communication systems, with a strong\nemphasis on precision alignment, wafer-level packaging, and packaging process\ndevelopment.\nKey Responsibilities\nDesign and develop photonic packaging solutions for integration of lasers,PICs, SOAs and other optical components\n\nLead optical, mechanical, and thermal co-design for high-densityoptoelectronic assemblies\n\nCollaborate with cross-functional teams (R&D, process, reliability, and testengineering) to optimize packaging architecture\n\nDrive active/passive alignment strategies for sub-micron precision in fiber andchip coupling\n\nDevelop and validate emerging photonic interconnect technologies includingphotonic wire-bond, co-packaged optics, and fiber optical connectors\n\nConduct DFM (Design for Manufacturability) and transfer of packagingprocesses to volume production\n\nEvaluate and qualify materials, processes, and photonics interconnects forphotonic packaging\n\nAuthor detailed documentation including design specs, process flows, andtest protocols\n\nRequired Qualifications\nBachelor’s or Master’s degree in Electrical Engineering, Optical Engineering,Physics, or related field\n\n5+ years of hands-on experience in photonics packaging, with a strong focuson laser, PIC, and SOA heterogeneous integration\n\nDeep understanding of optical coupling techniques, waveguide interfaces, andphotonic device behavior\n\nExperience with cleanroom processes, micro-assembly, and fiber attach\nStrong knowledge of CAD tools (SolidWorks), optical simulation software(Lumerical, Zemax), and thermal modeling tools\n\nExcellent problem-solving skills and ability to work in a fast-paced, collaborativeenvironment\n\nPreferred Skills\nExperience with silicon photonics or InP platforms\nFamiliarity with high-speed optical transceivers and telecom/datacomstandards\n\nBackground in automated packaging systems and precision robotics\nKnowledge of RF packaging 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