{"id":2468829,"url":"https://alion.io/job/xscape-photonics-staffprincipal-thermal-engineer","title":"Staff/Principal Thermal Engineer","company":{"id":3862680,"name":"Xscape Photonics","domain":"xscapephotonics.com","url":"https://alion.io/company/xscapephotonics","size_band":"51-200","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Greenhouse","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Santa Clara, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":120000,"max_usd":241000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1829},"experience_years_min":12,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":false},{"name":"MATLAB","optional":true},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-09-23T20:51:17Z","employer_posted_date":"2026-10-13","last_verified_at":"2026-10-24T02:00:36Z","board_verified":true,"closed_at":null,"days_open":30,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":30},"description":"Staff/Principal Thermal Engineer\nAbout the Company\nXscape Photonics is a cutting-edge technology company developing advanced photonic systems for high-\nperformance computing and communication applications. Our work focuses on enabling next-generation\noptical interconnects through innovative integration of photonics, electronics, and packaging technologies.\nWe are building highly efficient, scalable solutions where thermal management plays a critical role in\nperformance, reliability, and product success.\nWe are seeking a Staff or Principal Thermal Engineer to own thermal architecture, performance, and\nstrategy for our photonic and electronic systems - from early concept through production. This is a high-\nownership role: you will set the thermal design direction across programs, own module thermal\nperformance against target temperature and crosstalk limits, lead the development of cooling solutions\n(TECs, TIMs, heat spreaders/heat sinks, air and liquid cooling), drive simulation and validation\nmethodology, and own thermal-related failure analysis. You will represent thermal engineering in\ncustomer- and leadership-facing technical reviews, work closely with optical, mechanical, electrical,\npackaging, firmware, and reliability engineers, and mentor and guide other thermal engineers as the team\nscales.\nKey Responsibilities\nThermal Design & Analysis\nOwn thermal architecture and strategy for photonic modules and systems across multiple\nprograms, from concept through production\nLead design and development of cooling solutions using:\nThermoelectric coolers (TECs)\nThermal interface materials (TIMs)\nHeat spreaders and heat sinks\nAir cooling and liquid cooling approaches\nPerform thermal trade-off analysis across candidate designs, evaluating cost, power\nconsumption, and mechanical and electrical complexity to guide architecture decisions\nLead critical cooling-technology, material, and supplier decisions (TECs, TIMs, cooling solutions),\nbalancing product performance, cost structure, and long-term scalability\nSet thermal simulation methodology and standards; drive CFD analysis strategy (temperature\ndistribution, heat flow, thermal crosstalk) and review the work of other engineers\nDefine and own the thermal test and validation strategy, including instrumentation\n(thermocouples, IR imaging, DAQ/LabVIEW) and test-to-simulation correlation\nThermal Failure Analysis\nOwn thermal-related failure analysis, working closely with the Lead FA Engineer on the overall FA\nprocess\nDiagnose thermal-stack failure modes such as TIM pump-out and dry-out, solder void growth,\nbond-line degradation, TEC fatigue over thermal cycling, and warpage-driven loss of contact\nApply thermal FA diagnostic techniques - IR/lock-in thermography for hot-spot localization,\nthermal transient testing and structure-function analysis, and coordination of CT/acoustic\nmicroscopy for interface defect detection\nFeed FA findings back into design margin, TIM/material selection, and thermal qualification\ncriteria to prevent recurrence\nCross-Functional Leadership\nOwn accountability for module thermal performance against targets - define the thermal budget,\njunction and case temperature limits, TEC/laser operating windows, and allowable thermal\ncrosstalk, and hold the design to them from prototype through production and across the\nproduct & operating life\nOwn thermal integrity of the system, including thermal runaway prevention, heat-path\noptimization, and definition and enforcement of worst-case operating margins and guard-bands\nacross environmental and use-case variations\nRepresent thermal engineering in customer and executive/leadership reviews; present thermal\ncompliance, risk, and trade-offs at program milestones\nPartner with mechanical, PCB, and packaging engineering to integrate thermal requirements\nearly in design\nSupport new product introduction (NPI) and transfer to manufacturing, including design for\nmanufacturability and production ramp - working with contract manufacturers and assembly\nteams on TIM application, reflow, and thermal-stack assembly processes to ensure thermal\nperformance holds in volume production\nMentor and provide technical guidance to junior and mid-level thermal engineers; may directly or\nindirectly lead a small thermal team as it scales\nOwn thermal risk assessment, design reviews, and technical documentation across programs\nRequired Qualifications\nMasters or PhD in Mechanical Engineering, Aerospace Engineering, or a related field, with a\nfocus on heat transfer and fluid mechanics\n8+ years of thermal engineering experience for Staff, or 12+ years for Principal (PhD + 5+ years\nof industry experience may be considered equivalent to MS + 8+ years for Staff-level scope)\nDemonstrated track record designing and delivering cooling solutions using TECs, TIMs, heat\nspreaders/heat sinks, and air and liquid cooling\nDeep CFD simulation expertise (e.g., Ansys Icepak/Fluent, Ansys Mechanical, or equivalent) with\na record of setting simulation strategy, not only executing models\nExtensive hands-on thermal test and validation experience (IR imaging, thermocouples, DAQ\nsystems) with demonstrated test-to-simulation correlation\nDemonstrated root-cause problem solving and thermal failure analysis, including experience\ndiagnosing thermal-stack failure modes and applying thermal diagnostic techniques (e.g., IR/lock-\nin thermography, thermal transient testing)\nExperience owning thermal architecture at the system or program level, not solely at the\ncomponent level\nStrong teamwork and cross-functional collaboration skills, with the ability to work effectively\nalongside optical, mechanical, electrical, packaging, firmware, and reliability engineers\nExcellent written and verbal communication skills, including the ability to present complex thermal\nanalyses and trade-offs clearly to both technical and non-technical audiences\nThis is a full-time, on-site role based in Santa Clara, CA\nPreferred Skills\nExperience in photonics, optical transceivers, or high-density electronics packaging\nExperience with vapor chamber thermal design for high power-density, space-constrained\napplications\nExperience presenting thermal compliance and risk directly to customers or executive leadership\nPrior mentorship or direct/indirect leadership of other thermal engineers\nProgramming and data analysis skills (Python, MATLAB) for test automation and data processing\nExperience with qualification/certification test campaigns and thermal reliability of materials and\ninterfaces\nWhat We Offer\nOwnership of thermal strategy on advanced photonics systems at the ground floor of a fast-\nscaling startup\nCollaborative and innovative work environment with direct access to leadership\nCompetitive salary, equity, and benefits\nCareer growth in a rapidly evolving technology 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