Overview
News
Salaries
Products
People
Growth
Offices
Financials
Funding and backers
Total raised
$10.2M
1 round on record
Latest round
$10.2M
Venture round · Dec 2025 · 9 mo ago
Team
11
US Form 5500 (plan participants) · Dec 2025
Backers
1
Hitachi Ventures
The money's age
Fresh money
9 months since the last round · not hiring
Momentum
35/100
in the news, fresh money
Last sign of life
this month
a posting or a news item
The story so fareach stage dated by its source: the company's releases, the press, registers, filings
Sep 17
Launched NovoLINC Launches MaxLINC, Achieving Industry-Leading 0.7 mm²K/W Thermal Resistance for Multi-Kilowatt AI Chips · PRNewswire
Dec 8, 2025
Raised a round Venture round $10.2M · SEC Form D
2022
Founded
Funding rounds
| Round | Date | Amount | Investors | Source |
|---|---|---|---|---|
| Venture round | Dec 2025 | $10.2M | — | SEC Form D |
Registers and programsofficial lists and records that name the company
| Legal entity | NovoLINC Inc. | SEC Form D |
Founders and leadersfrom filings, registers and the company's site
Robert WennerExecutive OfficerSEC Form D
Ning LiExecutive Officer, DirectorSEC Form D
Sheng ShenExecutive Officer, DirectorSEC Form D
Backed byfrom the funds' portfolios and accelerator catalogs
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News
NovoLINC Launches MaxLINC, Achieving Industry-Leading 0.7 mm²K/W Thermal Resistance for Multi-Kilowatt AI Chips
/PRNewswire/ -- NovoLINC, an innovator in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the launch of...
Read more
Report
NovoLINC Raises New Capital to Break the Thermal Barrier Limiting Next-Gen AI Chips
/PRNewswire/ -- NovoLINC, a leader in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the closing of an...
Read more
Report
TDK Ventures Invests in NovoLINC's Advanced Thermal Interface Solutions for Next Generation AI Computing
Read more
Report
TDK Ventures Invests in NovoLINC's Advanced Thermal Interface Solutions
TDK Ventures invests in NovoLINC, targeting advanced thermal solutions to address cooling challenges in AI computing and data centers.
Read more
Report
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People

Robert Wenner
Executive Officer

Ning Li
Executive Officer, Director

Sheng Shen
Executive Officer, Director

Tina Tosukhowong
Director

Eric Rosenblum
Director

Paul Sheng
Director
Names and roles come from public filings, company registers and the company's own site. Is this you? Correct or remove · How we handle this data
Offices
Where the company hires and what each office is for
Cities
1
Hiring now
0
Countries
1
Pittsburgh
United States
HQ
10-50 est. staff
Financials
Total raised
$10.2M
Latest round
Venture - Series Unknown
Funding rounds
1
Funding rounds
| Round | Announced | Amount | |
|---|---|---|---|
| Venture - Series Unknown | 2025 | $10.2M | Details |

Hitachi Ventures