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Salary
$70k – $115k per year
Location
In office (Covington)
Overview
Company
Impact
Profile match
Absolics glass substrates provide differentiated value such as increased performance, reduced power consumption, and form factor to HPC-related packaging companies, data centers, AI, etc.

Position: PHYSICAL FAILURE ANALYSIS ENGINEER - Bilingual in Korean

Location: COVINGTON, GA

 

JOB SUMMARY

Responsible for performing physical failure analysis of glass substrates.  This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

 

DUTIES/RESPONSIBILITIES:

  • Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques
  • Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features
  • Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales
  • Analyze images to identify defects, fractures, corrosion, and other anomalies
  • Analyze data collected from various analyses to develop comprehensive understanding of failure mechanisms
  • Generate detailed reports outlining findings, analysis methodologies, and recommendations
  • Utilize spectroscopic methods to identify material compositions and elemental distributions
  • Perform mechanical and thermal testing
  • Prepare reports and documentation of failure analysis results
  • Work with other engineers and scientists to develop and improve the failure analysis process
  • Participate in quality control procedures, including instrument calibration and performance check
  • Troubleshoot technical issues
  • Provide support to the OQA function with analysis results

  REQUIREMENTS :

  • Experiences on SEM / FIB equipments (Analysis tools)
  • Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)
  • Excellent analytical and problem-solving skills to identify root cause of failures
  • Strong attention to detail and ability to accurately document findings and observations
  • Excellent communication skills and a proven ability to juggle multiple high priority tasks

QUALITIFICATIONS :

  • Strong knowledge of electronic devices and their failure mechanisms
  • Experience with a variety of failure analysis techniques
  • Proficiency in microscopy techniques, material analysis, and spectropy
  • Strong understanding of material properties, fracture mechanics, and root cause analysis
  • Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

 

EDUCATION:

  • Bachelor’s degree in material science, electrical engineering, or related field

 

EXPERIENCE:

  • 0+ years of experience in physical failure analysis in electronic or semiconductor applications
  • Experience in a Manufacturing Environment

SALARY:

  • $70,000 - $115,000
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