Process Development Engineer (Photonics)

Key Responsibilities

• Develop interconnect processes and build heterogeneously integrated electronic and optoelectronic packages using state of the art equipment at TAP.
• Run DOE experiments to find best machine parameters to achieve successful builds of advanced packages. Such processes include flip chip, solder, attach, plasma cleaning, thermal compression bonding, additive printing, and dispensing.
• Evaluate and qualify materials including solders used in electronic and optoelectronic packages as required by customers' application.
• Work with high precision equipment to build parts with good solder interconnect integrity and reliability.
• Perform continuous inspection, characterization, and metrology of a process to make sure process is robust.
• Serve as a liaison with marketing, vendors, purchasing and customer on technical information
• Interpret failure analysis reports and cross-sections to understand solder joint integrity.
• Gather and analyze data: Conduct root cause and failure mode analysis to efficiently improve yields and device performance.

Develop and perform semiconductor assembly processes such as:

• Active alignment fiber attach
• Optical component alignment
• Wafer Dicing
• Die pick/sort

• Other reasonable duties assigned.

Minimum Qualifications, Process Development Engineer (Photonics)

• Bachelor's degree in mechanical engineering, materials Science, engineering physics, or equivalent from a college or University accredited by the USDOE or internationally recognized accrediting organization.
• 3+ years of experience in fabrication, packaging, or semiconductor devices as well as experience in fiber attach, dicing, or wire bonding.

Preferred Qualifications, Process Development Engineer (Photonics)

• Master's Degree or PhD in Mechanical Engineer, Materials Science, Engineering, Physics or equivalent from a college or University accredited by the USDOE or internationally recognized accrediting organization.
• Strong understanding of engineering and materials science fundamentals and a demonstrated aptitude to learn.
• Experience in cleanroom, high precision equipment, inspection, and characterization equipment in semiconductor assembly line.
• Experience in back-end assembly process including flip-chip bumping, thermal compression bonding, and solder reflow will be highly desirable.
• Experience with flux and fluxless soldering of eutectic solder alloys and intermetallic formation.
• Experience with failure analysis of solder joints
• Strict discipline to follow rules, specifications, have good attention to details as well as have good organization skills.
• DOE experience is a plus.
• Excellent oral and written communication skills.

This position is contingent on the satisfactory completion of a background check.