Thermal Design & Validation Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG), where you will help develop the next generation of liquid-cooled AI and high-performance computing platforms. As a Staff Liquid Cooling Thermal Design & Validation Engineer, you will be part of a highly collaborative thermal engineering team responsible for creating innovative cooling solutions that enable AMD’s industry-leading data center GPU products. In this role, you will work across the entire product development lifecycle, partnering with thermal engineers, mechanical engineers, silicon teams, system architects, manufacturing partners, and external vendors to develop and validate advanced thermal solutions. Your work will span from concept development and simulation to hands-on laboratory testing and prototype validation. You will have the opportunity to influence the design of cutting-edge AI hardware while working in a fast-paced environment that combines technical innovation, experimentation, and real-world product impact.

THE PERSON:

The ideal candidate is a self-starter who enjoys solving complex engineering challenges and thrives in a collaborative, fast-paced environment. They are naturally curious, enjoy hands-on technical work, and possess strong problem-solving and troubleshooting abilities.Successful candidates are comfortable working across multiple disciplines, communicating with technical and non-technical stakeholders, and driving projects forward with minimal oversight. They are motivated by learning new technologies, tackling challenging engineering problems, and contributing to innovative products that push the boundaries of AI and data center computing.

KEY RESPONSIBILITIES:

• Develop and validate liquid cooling solutions for AMD data center GPU and AI computing platforms.
• Drive thermal-mechanical solution development from concept through prototype validation and production readiness.
• Collaborate with internal engineering teams and external vendors to develop innovative cold plate, heat sink, and liquid cooling technologies.
• Perform thermal simulations and laboratory-based validation testing.
• Conduct flow, pressure drop, temperature mapping, and thermal performance measurements.
• Analyze test results, identify thermal bottlenecks, and recommend design improvements.
• Generate technical documentation and communicate findings to engineering stakeholders.
• Contribute to continuous improvement initiatives that enhance product quality, reliability, and time-to-market.
• Support the development and deployment of next-generation liquid-cooled server and rack-level cooling solutions.

PREFERRED EXPERIENCE:

• Thermal design and validation of high-power electronics, AI platforms, HPC systems, or data center server products.
• Development of liquid cooling technologies including cold plates, heat sinks, and rack-level cooling solutions.
• Experience working with vendors and suppliers on thermal-mechanical solution development.
• CFD analysis using Icepak, FloTHERM, Ansys Fluent, or similar tools.
• Strong understanding of heat transfer, fluid mechanics, electronics cooling, and thermal management principles.
• Flow network modeling, pressure drop analysis, and coolant optimization.
• Laboratory testing, instrumentation, telemetry systems, data acquisition, and thermal characterization.
• Mechanical design experience using Creo, SolidWorks, or similar CAD tools.
• Knowledge of GD&T, manufacturing tolerances, assembly processes, and design-for-manufacturing methodologies.
• Understanding of cold plate manufacturing technologies including machining, brazing, skiving, friction stir welding, or additive manufacturing.
• Experience with thermal and mechanical validation of liquid-cooled server platforms.
• Familiarity with FEA, statistical analysis, design optimization, and experimental methodologies.
• Experience with Python, MATLAB, LabVIEW, or similar tools for automation and data analysis.
• Familiarity with Open Compute Project (OCP) standards and modern AI infrastructure architectures.

ACADEMIC CREDENTIALS:

• Bachelor's or master’s degree preferred in Mechanical Engineering or a related engineering discipline.
• Master's degree preferred in Mechanical Engineering, Thermal Engineering, Heat Transfer, Fluid Mechanics, or a related field.
• Doctoral degree desired.
• Relevant certifications, research experience, or specialized training in thermal engineering, CFD, liquid cooling, or mechanical design are a plus.

LOCATION: Secaucus, New Jersey

This role is not eligible for visa sponsorship.

#LI-CS1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG), where you will help develop the next generation of liquid-cooled AI and high-performance computing platforms. As a Staff Liquid Cooling Thermal Design & Validation Engineer, you will be part of a highly collaborative thermal engineering team responsible for creating innovative cooling solutions that enable AMD’s industry-leading data center GPU products. In this role, you will work across the entire product development lifecycle, partnering with thermal engineers, mechanical engineers, silicon teams, system architects, manufacturing partners, and external vendors to develop and validate advanced thermal solutions. Your work will span from concept development and simulation to hands-on laboratory testing and prototype validation. You will have the opportunity to influence the design of cutting-edge AI hardware while working in a fast-paced environment that combines technical innovation, experimentation, and real-world product impact.

THE PERSON:

The ideal candidate is a self-starter who enjoys solving complex engineering challenges and thrives in a collaborative, fast-paced environment. They are naturally curious, enjoy hands-on technical work, and possess strong problem-solving and troubleshooting abilities.Successful candidates are comfortable working across multiple disciplines, communicating with technical and non-technical stakeholders, and driving projects forward with minimal oversight. They are motivated by learning new technologies, tackling challenging engineering problems, and contributing to innovative products that push the boundaries of AI and data center computing.

KEY RESPONSIBILITIES:

• Develop and validate liquid cooling solutions for AMD data center GPU and AI computing platforms.
• Drive thermal-mechanical solution development from concept through prototype validation and production readiness.
• Collaborate with internal engineering teams and external vendors to develop innovative cold plate, heat sink, and liquid cooling technologies.
• Perform thermal simulations and laboratory-based validation testing.
• Conduct flow, pressure drop, temperature mapping, and thermal performance measurements.
• Analyze test results, identify thermal bottlenecks, and recommend design improvements.
• Generate technical documentation and communicate findings to engineering stakeholders.
• Contribute to continuous improvement initiatives that enhance product quality, reliability, and time-to-market.
• Support the development and deployment of next-generation liquid-cooled server and rack-level cooling solutions.

PREFERRED EXPERIENCE:

• Thermal design and validation of high-power electronics, AI platforms, HPC systems, or data center server products.
• Development of liquid cooling technologies including cold plates, heat sinks, and rack-level cooling solutions.
• Experience working with vendors and suppliers on thermal-mechanical solution development.
• CFD analysis using Icepak, FloTHERM, Ansys Fluent, or similar tools.
• Strong understanding of heat transfer, fluid mechanics, electronics cooling, and thermal management principles.
• Flow network modeling, pressure drop analysis, and coolant optimization.
• Laboratory testing, instrumentation, telemetry systems, data acquisition, and thermal characterization.
• Mechanical design experience using Creo, SolidWorks, or similar CAD tools.
• Knowledge of GD&T, manufacturing tolerances, assembly processes, and design-for-manufacturing methodologies.
• Understanding of cold plate manufacturing technologies including machining, brazing, skiving, friction stir welding, or additive manufacturing.
• Experience with thermal and mechanical validation of liquid-cooled server platforms.
• Familiarity with FEA, statistical analysis, design optimization, and experimental methodologies.
• Experience with Python, MATLAB, LabVIEW, or similar tools for automation and data analysis.
• Familiarity with Open Compute Project (OCP) standards and modern AI infrastructure architectures.

ACADEMIC CREDENTIALS:

• Bachelor's or master’s degree preferred in Mechanical Engineering or a related engineering discipline.
• Master's degree preferred in Mechanical Engineering, Thermal Engineering, Heat Transfer, Fluid Mechanics, or a related field.
• Doctoral degree desired.
• Relevant certifications, research experience, or specialized training in thermal engineering, CFD, liquid cooling, or mechanical design are a plus.

LOCATION: Secaucus, New Jersey

This role is not eligible for visa sponsorship.

#LI-CS1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.