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Location
In office (Premstätten)
Seniority
Staff · 10+ years exp
Visa
Sponsors visas in United States; no register of this country names it

Confirmed on the employer's own hiring board on Nov 15, 2026. First seen by Alion on Nov 13, 2026. ams OSRAM scores A on the Alion truth index.

Overview
Company
Impact
Profile match
ams OSRAM is an Austrian semiconductor company headquartered in Premstaetten near Graz. It designs optical sensors, emitters and lighting components used in smartphones, cars and medical devices. The group was formed when ams acquired the German lighting company OSRAM and is listed on the SIX Swiss Exchange.
  • Develop packages & package technologies for digital photonics (datacom, AR/VR) and optical sensors (ambient light, color, proximity) as part of the engineering team
  • Carry out package design (mechanical & optical design, bill of materials, simulations) and manufacturing at assembly partners
  • Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
  • Execute package development to successful completion within given resource constraints (time, budget)
  • Continuously improve package technologies to achieve time, quality and cost targets
  • Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
  • Identify and introduce cost improvements for high volume production
  • Identify and develop new suppliers / technologies

Who we are looking for

  • Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
  • 10 year+ experience in advanced semiconductor packaging
  • Technical modelling and drawing in SolidWorks and AutoCAD beneficial
  • Experience in high volume manufacturing for consumer electronics applications is a benefit
  • Experience in collaboration with external manufacturing partners (OSATs)
  • Failure analysis and reliability engineering knowledge, basic knowledge of MEMS and CMOS manufacturing technologies
  • Demonstrated analytical and problem-solving skills, hands-on-mentality, ability to execute developments within tight resource constraints (time, budget)
  • Ability to cope with high workloads in critical project stages and collaborate with diverse teams in multiple geographical locations
  • Strong communication skills, creativity and problem-solving skills
  • Openness to business travel for several weeks per year
  • Fluent in English

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).

We offer a higher compensation depending on your expertise and skills.

Please contact Hana Krsul for further information via [email protected] or +43 664 9665611.

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