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Salary
≈ $79k – $179k per year (Estimated)
Location
In office (Premstätten)
Seniority
Principal · 10+ years exp

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Sep 25, 2026.

Overview
Company
Impact
Profile match
ams OSRAM is an Austrian semiconductor company headquartered in Premstaetten near Graz. It designs optical sensors, emitters and lighting components used in smartphones, cars and medical devices. The group was formed when ams acquired the German lighting company OSRAM and is listed on the SIX Swiss Exchange.

We are looking for a hands-on Principal RF Photonics Engineer (d/m/f) driving lab metrology, and PCB design methodology efforts for electro-optical data transmission using Photonic Integrated Circuits (PICs). If you enjoy designing high-speed printed circuit boards, automating complex test setups from wafer to board level, we would love to connect with you.

Tasks and responsibilities:

  • RF & Electro-Optical Characterization: Evaluate high-speed electro-optical data transmission links by measuring Bit Error Rates (BER), eye diagrams, jitter, S-parameters, and noise performance.
  • Wafer-Level Metrology: Design and execute advanced wafer-level optical and RF probing procedures, establishing rigorous calibration routines and measurement methodologies for PICs.
  • PCB Design & Hardware Integration: Design high-speed PCBs and custom test boards for electro-optical interfaces, integrating drivers, TIAs, and RF components with minimal signal loss.
  • Signal & Power Integrity: Analyze and optimize signal and power delivery networks for high-speed photonic systems to minimize jitter, power droop, and electromagnetic interference.
  • Test & Measurement Automation: Develop and scale Python- and/or LabView based automation scripts for efficient and accurate wafer-level probe station control and data acquisition.
  • Simulation & Correlation: Use tools like Keysight ADS and MATLAB to simulate link performance, correlate models with empirical wafer and board data, and resolve bottlenecks.
  • Collaboration: Work closely with PIC designers and packaging engineers to optimize test structures, probe footprints, and prototype bring-up.

Who we are looking for

  • Degree: M.S. or Ph.D. in Electrical Engineering, Applied Physics, Optical Engineering, or a related field
  • Experience: 10+ years of hands-on lab, wafer-level testing, and engineering experience in microwave photonics or high-speed optical communications
  • Wafer-Level Probing & Metrology: Strong practical expertise in optical and RF wafer probing, calibration, and high-frequency test equipment (VNAs, optical oscilloscopes, BERTs, and Lightwave Component Analyzers)
  • PCB Design: Demonstrated experience designing high-speed, controlled-impedance PCBs for RF and optoelectronic applications (using tools like Altium, Cadence, or equivalent)
  • Automation & Scripting: Proficiency in Python and/or LabView for test bench automation and advanced data Analysis
  • Signal Analysis: Solid understanding of high-speed signal integrity, NRZ/PAM4 signaling, and the interpretation of eye diagrams and BER curves
  • Simulation Tools: Experience with design and analysis software such as Keysight ADS, Cadence Virtuoso and MATLAB
  • PIC Familiarity: Working knowledge of Photonic Integrated Circuits, modulators, photo detectors and emitters
  • Languages: Proficiency in English, both written and spoken; German is a plus

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).

We offer a higher compensation depending on your expertise and skills.

Please contact Julia Zajac for further information via [email protected] or +48 (61) 8809988.

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