Technical Program Manager - Image Sensor & Process Integration
Confirmed on the employer's own hiring board on Oct 24, 2026. First seen by Alion on Oct 24, 2026. Apple scores A on the Alion truth index.
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.
Here at Apple we don’t just create products - we create the kind of wonder that’s revolutionized entire industries. It’s the diversity of our people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Product Operations at Apple, and help us leave the world better than we found it.
Description
You will take the lead in driving continuous improvement activities for semiconductor device processes during product development, ramp up and throughout the product lifetime. You will work with Apple’s internal engineering team, our semiconductor device vendors and downstream with module and system integrators.
The scope covers image sensor devices used in all modules and all systems. And, the right candidate will work across multiple locations in various continents with on-site visits with our vendors.
Minimum Qualifications
7 + years technical understanding of semiconductor devices, involving problem solving and issue root cause analysis / data analysis in a pressured environment
MS / PhD in Electrical Engineering, semiconductor devices, or allied technical subject
Preferred Qualifications
Interpersonal skills of leadership, communication, teamwork, project management, and influencing.
Flexibility: Evening and weekends work will be required. The job also requires international travel.
Good working knowledge of semiconductor devices and associated module components is preferred (e.g. silicon processing or III-V, etc.).
Understanding of semiconductor processes (etch, litho, etc.) wafer test, yield, wafer fab process integration, wafer packaging, back-end issues.
Familiarity with quality systems and quality control.