Account Technologist (PVD Advanced Packaging)

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

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You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

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Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.
• Understand Customers and Fabless stakes holders technical roadmap.
• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.
• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).
• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.
• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.
• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.
• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.
• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).
• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.
• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.
• Proficiency in SPC, DOE, metrology, and yield analytics.
• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.
• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

Work Location

• Science Park II (Moving to Tampines starting from mid-2027)

Additional Information

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Travel:

Relocation Eligible:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.