College Intern - GT Indigo Inter-Die Gapfill Process and Integration for 3DIC

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

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Job Description

Position Summary

The Process Engineer Intern will support the development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications. The intern will work closely with process, hardware, and materials engineers to conduct experiments, analyze data, and contribute to new technology development for next-generation semiconductor devices.

This internship provides hands-on exposure to semiconductor manufacturing equipment, process development methodologies, statistical data analysis, and advanced packaging technologies.

Key Responsibilities

Process Development

Assist engineers in designing and executing process engineering experiments.

Support development and optimization of CVD, PECVD, PEALD, or related thin film deposition processes.

Perform wafer processing and experimental runs according to defined procedures.

Analyze process results and identify opportunities for performance improvement.

Characterization & Data Analysis

Collect and analyze process and metrology data.

Characterize film properties including:

Thickness

Uniformity

Refractive Index

Stress

Composition

Surface Roughness

Electrical Properties

Utilize statistical methods and data visualization tools to identify trends and correlations.

Film characterization and integration test on AMAT internal test vehicle

Problem Solving

Support troubleshooting of process and equipment-related issues.

Participate in structured root cause analysis activities.

Document findings and propose corrective actions.

Documentation & Communication

Maintain accurate experimental records and engineering logs.

Prepare technical reports and presentations summarizing findings.

Present project progress and final internship results to engineering leadership.

Cross-Functional Collaboration

Work with Process, Hardware, Manufacturing, and Product Engineering teams.

Participate in technical discussions and project review meetings.

Support customer-focused development activities where appropriate.

Preferred Project Areas

Depending on business priorities, interns may be assigned projects related to:

Low-temperature dielectric deposition

Advanced packaging materials development

Wafer bonding process optimization

Gap fill process development

Film characterization and metrology correlation

Process hardware characterization

Process automation and data analytics

AI-assisted process optimization

Preferred Qualifications

Knowledge of semiconductor manufacturing processes.

Basic understanding of thin film deposition, plasma processing, or surface science.

Experience with experimental design and data analysis.

Strong problem-solving and analytical skills.

Effective verbal and written communication skills.

Ability to work independently and collaboratively in a team environment.

Learning Outcomes

By the end of the internship, the intern will gain experience in:

Semiconductor process development methodology

Advanced packaging technologies

Experimental design and DOE execution

Thin film characterization techniques

Engineering problem solving and root cause analysis

Technical presentation and communication skills

Working in a global semiconductor equipment company

Additional Information

Time Type:

Employee Type:

Travel:

Relocation Eligible:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.