Sr. Module Engineer, Hybrid Bonding

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

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PositionSummary

Weareseekingahighlymotivated Die-to-WaferHybridBondingModuleEngineer todevelopandscalenext-generationhybridbondingtechnologiesforadvancedsemiconductorpackagingapplicationsincludingMemory,chiplets,AIaccelerators,photonics,andheterogeneousintegrationplatforms.

The successful candidate will lead process module development across die preparation, surface activation, die placement, hybrid bonding, post-bond characterization, yield improvement,andmanufacturingscale-up.Thisrolerequiresclosecollaborationwithequipmentdevelopmentteams,processintegrationengineers,materialsscientists,devicearchitects,andexternalecosystempartners.

The position is ideal for candidates passionate about enabling future high-bandwidth and energy-efficient computingsystemsthroughadvancedinterconnecttechnologies.Hybridbondingtechnologiesincludingcopper-copperanddielectric-dielectricdirectbondingarecriticalenablersfornext-generation3DintegrationandHBMstacking.

KeyResponsibilities

HybridBondingProcessDevelopment

• Developandoptimizedie-to-wafer(D2W)hybridbondingprocessesforadvancedpackagingapplications.
• Establishprocesswindowsfor:
  • Surfacepreparation
  • Plasmaactivation
  • Dieplacement
  • Alignmentandoverlaycontrol
  • Bondingtemperatureandpressureoptimization
  • Post-bondannealing
• DriveCu-Cuanddielectric-dielectricinterconnectformationwithfocusonelectricalperformanceandreliability.

ProcessIntegration

• Supportintegrationofhybridbondinginto:
  • Memory architectures
  • Chiplet-basedsystems
  • Siliconinterposers
  • System-on-Waferplatforms
  • Co-packagedoptics(CPO)
• Collaboratewithintegrationteamstoresolveprocessinteractionsandyieldexcursions.

YieldandDefectReduction

• Identifyrootcausesof:
  • Bondvoids
  • Dieshift
  • Overlayerrors
  • Non-uniformbonding
  • Particlecontamination
• UtilizeDOEmethodologiesandstatisticalprocesscontroltoimproveyieldandprocessrobustness.

MetrologyandCharacterization

• Drivebondingqualitycharacterizationusing:
  • CSAM
  • X-rayinspection
  • FIB/SEM
  • AFM
  • Opticalmetrology
  • Electricalteststructures
• Developcorrelationbetweenprocessparametersandpackageperformance.

EquipmentandTechnologyDevelopment

• Workcloselywithequipmentengineeringteamson:
  • Hybridbondingsystems
  • Dieplacementtools
  • Plasmaactivationmodules
  • Surfacepreparationmodules
  • Integratedprocesscontrolsolutions
• Participateinevaluationandqualificationofnext-generationbondingplatforms.

ReliabilityEngineering

• Defineandexecutereliabilitytestplans:
  • Thermalcycling
  • HTOL
  • Mechanicalpull/sheartesting
  • Moisturesensitivityevaluations
• Drivefailureanalysisandcorrectiveactions.

TechnicalLeadership

• Leadcross-functionalprojectsfromconceptthroughtechnologytransfer.
• Publishtechnicalresultsinternallyandexternally.
• Presentdevelopmentprogresstoengineeringleadershipandcustomers.
• Mentorjuniorengineersandresearchers.

• MinimumQualifications

• Education

  • M.S.in:
    • MaterialsScience
    • ElectricalEngineering
    • MechanicalEngineering
    • ChemicalEngineering
    • Physics
    • SemiconductorManufacturing
  • OR
  • Ph.D.inoneoftheabovedisciplines

  Experience

  • Minimum5+yearsofsemiconductorprocessdevelopmentexperienceaftergraduatedegree.
  • Directexperienceinatleastoneofthefollowing:
    • Hybridbonding
    • Thermocompressionbonding
    • Waferbonding
    • Advancedpackaging
    • HBM development
    • Cuinterconnecttechnology
    • Chipletintegration

  TechnicalSkills

  • Strongunderstandingof:
    • Cu-Cuinterconnectformation
    • Surfacechemistryandplasmaactivation
    • CMPandplanarization
    • Defectengineering
    • Semiconductorprocessintegration
    • Statisticalprocessanalysis
  • ExperiencewithDOEandJMP/Minitabanalysistools.
  • Familiaritywithmetrologyandfailureanalysistechniques.

  PreferredQualifications

  • Ph.D.with5+yearsindustryexperience.
  • ExperienceinHBMor3Dstackingtechnologies.
  • Experiencewith:
    • Hybridbondingequipmentdevelopment
    • Directbondinginterconnect(DBI)
    • Dieplacementsystems
    • Advancedpackagingprocessintegration
  • KnowledgeofAI/HPCpackagingarchitectures.
  • Experienceworkingwith200mmand300mmwafermanufacturingenvironments.
  • Trackrecordofpatents,publications,orconferencepresentations(ECTC,IEEE,IMAPS,SEMI,etc.).

  DesiredPersonalAttributes

  • Strongtechnicalleadership.
  • Excellentproblem-solvingskills.
  • Hands-onlaboratorymindset.
  • AbilitytodrivetechnologyfromR&Dintomanufacturing.
  • Effectivecommunicatoracrossengineering,operations,andcustomer-facingteams.
  • Passionforenablingnext-generationAIandhigh-performancecomputingplatforms.

Additional Information

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Travel:

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The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected],or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.