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Salary
$176k – $242k per year
Location
In office (Hillsboro)
Seniority
Architect · 12+ years exp

Confirmed on the employer's own hiring board on Sep 24, 2026. First seen by Alion on Aug 5, 2026. Applied Materials scores A on the Alion truth index.

Overview
Company
Impact
Profile match
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future.

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$176,000.00 - $242,000.00

Location:

Hillsboro,OR

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

The Global Field Group (GFG) at Applied Materials is the frontline organization responsible for installing, sustaining, and optimizing the industry’s most advanced semiconductor manufacturing equipment at customer sites around the world. GFG partners closely with customers to ensure tools operate at peak performance, enabling reliable,high-volume production of leading-edge chips. Through a combination of deep technical expertise, rapid problem solving, and close collaboration with engineering and product teams, GFG plays a critical role in turning innovation intoreal-world manufacturing success.

As Technical Director for a key logic account, you areone ofApplied'ssenior technical leaderson that account. You work directly with the customer to identify their highest-impact yield, performance, and cost challenges, build multi-product technology programs to solve them, and carry what you learn back intoApplied'sproduct roadmaps.

Why Join Us

  • Pioneering Innovation:Work ontheprocess technologies behindthe industry's most advanced logic nodes, from early development through high-volume manufacturing.
  • Collaborative Environment: Work in a dynamic, collaborative culture that values innovation, encourages creativity, and fosters professional growth.
  • Account Ownership: Serve as the senior technical voice on one ofApplied'smost strategic logic accounts, with direct visibility to customer and internal executives, influence over both the customer's device roadmap andApplied'sproduct roadmap, and a clear path to broader technical leadership.

Key Responsibilities

  • Lead account-wide strategic initiatives for device yield, performance, and cost improvement. These initiatives will involve bundling technology benefits across multiple Applied Materials product areas - deposition, etch, anneal, and metrology.
  • Interface with customers across these process areas at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies.
  • Identify technology inflections through customer engagement and articulate them to internal product and engineering teams to shape product roadmaps and mid- to long-term development priorities.
  • Ensure alignment between internal groups (commercial, technical, and operations) for key initiatives, driving consensus and outcomes through influence.
  • Own timelines, milestones, risk management, and deliverables for thestrategic initiatives and CIPs you lead.
  • Act as the senior technical authority for the account - supporting internal teams on deep technical issues (integration or unit process), mentoring engineers, and fostering a collaborative, high-performance environment across cross-functionalteams.Thisis a senior individual-contributor role: influence and technical authority are exercised across cross-functional teams rather than through direct reports, with potential for the scope to expand to people leadership over time.

Qualifications

Education:

  • B.S. in an engineering discipline, or M.S. in Physics, Chemistry, or an equivalent STEM field.Advanced degree (M.S. or Ph.D.) preferred.

Experience:

  • 12+ years of experience in the wafer fab or semiconductor capital equipmentindustry.
  • 15+ years preferred in semiconductor capital equipment process engineering, wafer fab process engineering, or wafer fab process integration within a technology development organization.
  • Demonstrated experience leading complex, cross-functional technical programs and influencing outcomes across engineering, commercial, and operations teams.
  • Proven experience partnering with customers at development and high-volume-manufacturing sites, including presenting to and building trust with senior technical and executive stakeholders.

Technical Expertise:

  • Recognized, in-depth technical expertise inone or more of the following:
  • Processengineering for a semiconductor process technology (deposition, etch, anneal, or metrology).
  • Processintegration of one or more segments ofa leading logic or advanced packaging process flow.
  • Strong understanding of leading logic technologies and process flows; advanced packaging experience preferred.
  • Experience bundling or integrating value across multiple process technologies (e.g., deposition, etch, anneal, metrology) to solve device-level yield, performance, or cost problems.

Skills & Competencies:

  • Ability to articulate complex technical concepts and value propositions clearly to both technical and business audiences.
  • Experience building and delivering presentations to senior executives.
  • Ability to lead and influence across organizational boundaries without direct authority.
  • Strong organizational and project management skills.
  • Demonstrated ability to manage multiple priorities in a dynamic environment.

Location & Travel

  • Location: Hillsboro, OR (on-site).
  • Travel:Less than20%, including domestic and international travel to customer sites.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected],or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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