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Salary
$37k – $61k per year (gross)
Location
In office (Singapore)
Experience
1+ year exp
Employment
Full-Time

First seen by Alion on Nov 10, 2026. ASMPT scores C on the Alion truth index.

Overview
Company
Impact
Profile match
ASMPT is a leading supplier of semiconductor assembly and surface mount technology equipment. Its die bonders and placement machines automate electronics manufacturing. The company is listed in Hong Kong and serves chipmakers worldwide.

We are seeking a skilled Mechanical Design Engineer to develop high-precision mechanical modules for advanced packaging applications in the semiconductor industry. The role involves conceptualizing, designing, and optimizing mechanical components to meet stringent industry requirements. You will work closely with cross-functional teams to drive innovation and enhance equipment performance.


Key Responsibilities:

  • Analyze customer requirements and translate them into mechanical design specifications.
  • Generate and validate design ideas using force analysis, thermal simulation, vibration simulation, and module lifetime estimation.
  • Select the most efficient design solutions, considering cost, manufacturability, and reliability.
  • Handle material selection to ensure durability and compatibility with semiconductor processes.
  • Design precision tooling and fixtures to support advanced packaging processes.
  • Develop 3D engineering models and perform structural analysis.
  • Collaborate with manufacturing and process engineers to ensure seamless integration and design for manufacturability (DFM).
  • Participate in continuous improvement activities to enhance design efficiency, performance, and reliability.
  • Ensure compliance with safety, quality, and environmental standards in accordance with Singapore’s workplace regulations.

Job Requirements:

  • Min. Degree or higher in Mechanical Engineering or a related field from a recognized institution.
  • Experienced in mechanical design, preferably in the semiconductor industry.
  • Proficiency in Solid Edge, SolidWorks, Pro-E, and AutoCAD.
  • Knowledge of advanced packaging technologies, including wafer-level packaging, 2.5D/3D integration, and flip-chip assembly, is an advantage.
  • Understanding of thermal management, vibration control, and high-precision motion systems is a plus.
  • Strong analytical and problem-solving skills with the ability to work in a fast-paced environment.

What we offer:
At ASMPT, we are committed to providing a supportive and rewarding work environment for our employees. Some of the key benefits you can expect include:

  • Competitive salary and performance-based bonuses
  • Company Transport
  • Flexible work arrangements
  • Comprehensive health and wellness benefits
  • Opportunities for professional development and career advancement
  • Collaborative and innovative company culture

Skills

Structural Analysis, Semiconductor Industry, Thermal Management, Precision Engineering, Vibration Control, Packaging, Material Selection, AutoCAD, Manufacturing, Mechanical Engineering

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