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Salary
$32k – $73k per year (Estimated)
Location
In office (Hong Kong)
Seniority
Junior
Employment
Full-Time
Overview
Company
Impact
Profile match
ASMPT is a leading supplier of semiconductor assembly and surface mount technology equipment. Its die bonders and placement machines automate electronics manufacturing. The company is listed in Hong Kong and serves chipmakers worldwide.
  • Design precision mechanical modules in the application of semiconductor equipment, including

    • Requirement analysis for customer

    • Idea generation and idea verification (using Force Analysis, Thermal Simulation Analysis, Vibration Simulation, Module Life Time Estimation, etc)

    • Solution selection

    • Material handling

    • Tooling design

  • Prepare 3D engineering design and model analysis

  • Involve in continuous design improvement activities such as Design for Manufacturing Equipment

Requirements

  • Degree or higher in Mechanical Engineering or relevant disciplines

  • Working experience in mechanical design preferred

  • Experience in Solid Edge, SolidWorks, Pro-E and AutoCAD is preferred

  • Basic understanding of semiconductor manufacturing process will be advantage

Attractive salary and fringe benefits package will be offered to the right candidates.

Interested parties please submit your application with cover letter, resume, certificate and transcripts.

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.

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