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Salary
≈ $40k – $72k per year (Estimated)
Location
In office (Westminster)
Seniority
Intern
Visa
H-1B filings in 12 months: 2
Employment
Internship

Confirmed on the employer's own hiring board on Nov 13, 2026. First seen by Alion on Sep 16, 2026. CesiumAstro scores A on the Alion truth index.

Overview
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CesiumAstro is an American company founded in Austin in 2017 that builds active phased array communications payloads for satellites, aircraft and defence platforms. Its systems are software-defined and electronically steered, which lets a moving platform track several links at once without mechanical antennas, and the company manufactures them in house rather than integrating third-party subsystems. It sells mainly to defence customers and satellite operators, has raised venture funding from investors including Airbus Ventures and Lightspeed, and operates facilities in Austin, Colorado and the United Kingdom.

The CesiumAstro mechanical team is looking for Summer 2027 interns to design and build space structures and thermal systems for satellite communication systems.

Mechanical systems interns will work closely with CesiumAstro engineers on product development, design, test, and manufacturing of structures and thermal systems for space communication systems. Areas of focus will include design of conduction-cooled packaging, deployable structures and mechanisms, and lightweight composite space structures. Assignments will be determined by a mix of project availability and the interests of the successful candidates.

CesiumAstro interns regularly present their work to peers, mentors, and CesiumAstro executive leadership throughout the course of the summer. As such, excellent written and verbal communication skills are required.

To apply, please include a cover letter describing your interest in mechanical systems and either space systems or communication systems.

JOB REQUIREMENTS AND MINIMUM QUALIFICATIONS

  • Current enrollment in a Bachelor of Science (BS), Master of Science (MS), or Ph.D. program in Mechanical Engineering or Aerospace Engineering from an accredited university.
  • GPA of 3.5 or higher.
  • Upper-level undergraduate coursework in structures and heat transfer.
  • Experience with mechanical FEA tools, such as SolidWorks Simulation or ANSYS.
  • Excellent written and verbal communication skills.

PREFERRED EXPERIENCE

  • Familiarity with electronics assemblies.
  • Experience with EMI/EMC mitigation techniques.
  • Experience with CNC manufacturing.
  • Aerospace or automotive electronics design, development, and qualification.
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