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Salary
≈ $71k – $143k per year (Estimated)
Location
In office (Ottawa)
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 30, 2026. First seen by Alion on Dec 17, 2025. AttoTude scores C on the Alion truth index.

Overview
Company
Impact
Profile match
AttoTude develops terahertz technology for data center networking, with an engine and wire product pairing designed to remove networking bottlenecks for artificial intelligence workloads. Its engineers design digital and mixed-signal chips and system hardware, and the company hires ASIC design engineers, materials scientists and fabrication technicians. The company is headquartered in Menlo Park, California, United States.

Role Description

This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.

Qualifications

  • Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.

    Mechanical, thermal and FEA modeling and design experience.

  • Proven track-record of product development, from concept through volume production. 

  • Ability to work effectively in cross-disciplinary teams and drive technical collaborations.

  • Excellent analytical and problem-solving skills.
  • Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
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